Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Kensuke IDE"'
Publikováno v:
Micro and Nano Engineering, Vol 2, Iss , Pp 1-6 (2019)
The hybrid bonding technique, used for the bonding of metal-electrode and insulator hybrid interfaces with a high alignment accuracy, is very important for the three-dimensional integration technology. Bonding of Cu and SiO2 hybrid interfaces was per
Externí odkaz:
https://doaj.org/article/8ee075332a9749aca3695e7983c89623
Autor:
Jun UTSUMI, Kensuke IDE
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 81, Iss 831, Pp 15-00408-15-00408 (2015)
It has been said that the end of Moore’s law will be reached in 10 to 20 years. Three dimensional integration technology is expected to be a possible solution in the post-Moore era. The bonding of the metal electrode and insulator hybrid interfaces
Externí odkaz:
https://doaj.org/article/21aed56b50b14e348648f367c30e157b
Publikováno v:
Hyomen Kagaku. 38:72-76
Publikováno v:
Journal of the Japan Society for Precision Engineering. 79:701-704
Publikováno v:
ECS Meeting Abstracts. :2113-2113
In three-dimensional integration technology, the bonding of metal electrode and insulator hybrid interface is very important technique. The hybrid interface serves as both an electrical connection and mechanical bond. However, the bonding of these hy
Publikováno v:
Japanese Journal of Applied Physics. 55:026503
The bonding of metal electrodes and insulator hybrid interfaces is one of the key techniques in three-dimensional integration technology. Metal materials such as Cu or Al are easily directly bonded by surface activated bonding at room temperature, bu