Zobrazeno 1 - 10 of 30 pro vyhledávání: '"Kenji, Okabe"'
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Akademický článek
Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems
Autor: Kenji Okabe, Horagodage Prabhath Jeewan, Shota Yamagiwa, Takeshi Kawano, Makoto Ishida, Ippei Akita
Publikováno v: Sensors, Vol 15, Iss 12, Pp 31821-31832 (2015)
In this paper, a co-design method and a wafer-level packaging technique of a flexible antenna and a CMOS rectifier chip for use in a small-sized implantable system on the brain surface are proposed. The proposed co-design method optimizes the system
Externí odkaz: https://doaj.org/article/395fb6202d2249a4adbffa9a1e6973b2
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3
Advanced use of Spread Sheet 1
Autor: Kenji, Okabe
Publikováno v: メディアと情報資源 : 駿河台大学メディア情報学部紀要. 23(1):33-42
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=jairo_______::c2550974b218da1480680431e1bb78ec
http://id.nii.ac.jp/1307/00001596/
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4
Silicon based on-chip antenna using an LC resonator for near-field RF systems
Autor: Kenji Okabe, Yasoo Harada, Wanghoon Lee, Makoto Ishida
Publikováno v: Solid-State Electronics. 67:100-104
This paper presents the silicon based on-chip antenna using a LC resonator. The proposed antenna consists of a stacked capacitor and a spiral inductor on silicon substrate. The spiral inductor structure without underpass was proposed for improvement
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::62bbb0f538d0fa32f0b4e55c81ca78e4
https://doi.org/10.1016/j.sse.2011.08.002
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7
Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems
Autor: Horagodage Prabhath Jeewan, Takeshi Kawano, Kenji Okabe, Ippei Akita, Makoto Ishida, Shota Yamagiwa
Publikováno v: Sensors
Volume 15
Issue 12
Pages 31821-31832
Sensors, Vol 15, Iss 12, Pp 31821-31832 (2015)
Sensors (Basel, Switzerland)
Sensors; Volume 15; Issue 12; Pages: 31821-31832
In this paper, a co-design method and a wafer-level packaging technique of a flexible antenna and a CMOS rectifier chip for use in a small-sized implantable system on the brain surface are proposed. The proposed co-design method optimizes the system
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ded63a2e2242f8ec4252be762a7528af
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8
A thin film flexible antenna with CMOS rectifier chip for RF-powered implantable neural interfaces
Autor: Makoto Ishida, Shota Yamagiwa, Takeshi Kawano, Ippei Akita, Kenji Okabe
Publikováno v: 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS).
This paper reports a parylene film antenna integrating a CMOS rectifier chip for wireless neural recording devices. An implanted antenna requires the flexibility to fit the shape of brain surface. In addition, an integrating technology with solid-sta
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::cff3bd105009cefd7a75333de4a4030c
https://doi.org/10.1109/transducers.2015.7181284
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