Zobrazeno 1 - 10
of 34
pro vyhledávání: '"Kenichiro YOSHITOMI"'
Autor:
Kenichiro YOSHITOMI
Publikováno v:
Journal of the Japan Society for Precision Engineering. 89:382-386
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::623522d19af45866aab41c38f07a0c64
https://doi.org/10.2493/jjspe.89.382
https://doi.org/10.2493/jjspe.89.382
Publikováno v:
International Journal of Automation Technology. 17:55-63
An increased removal rate is required to improve the production efficiency during the polishing of ultrahard-to-process materials. The rotational speed of the polishing pad is increased to increase the removal rate. However, research has not been ext
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::50bed83f83bc7581156fdf84aef1dc0c
https://doi.org/10.20965/ijat.2023.p0055
https://doi.org/10.20965/ijat.2023.p0055
Autor:
Kenichiro Yoshitomi, Atsunobu Une
Publikováno v:
Journal of the Japan Society for Precision Engineering. 86:620-625
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::da1edb4db9c59b56ab6f23e2991ed03b
https://doi.org/10.2493/jjspe.86.620
https://doi.org/10.2493/jjspe.86.620
Autor:
Atsunobu Une, Kenichiro Yoshitomi
Publikováno v:
International Journal of Automation Technology. 14:633-643
High precision is required for thin substrates used in the manufacturing processes for semiconductor devices and flat panel displays, and the required precision for substrate warp becomes more stringent every year. However, it is difficult to remove
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::44929779fe352330845246289b24c633
https://doi.org/10.20965/ijat.2020.p0633
https://doi.org/10.20965/ijat.2020.p0633
Publikováno v:
Precision Engineering. 64:45-52
In planarizing a thin substrate, it has been difficult to remove warp or waviness as such substrates are forcibly deformed by conventional clamping methods. To clamp a thin substrate with no deformation, we have developed a freezing pin chuck system
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::89855bf21e460d8a7ad2de7949072d29
https://doi.org/10.1016/j.precisioneng.2020.03.008
https://doi.org/10.1016/j.precisioneng.2020.03.008
Publikováno v:
Journal of the Japan Society for Precision Engineering. 85:787-792
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::30ab818636a335ae84a308161cea80bf
https://doi.org/10.2493/jjspe.85.787
https://doi.org/10.2493/jjspe.85.787
Publikováno v:
Journal of the Japan Society for Precision Engineering. 83:275-280
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a12eba0d4d6c20992509aacdfe6ac589
https://doi.org/10.2493/jjspe.83.275
https://doi.org/10.2493/jjspe.83.275
Publikováno v:
Journal of the Japan Society for Precision Engineering. 82:82-86
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::48cefa8a1f990533a2153dddd4927ccb
https://doi.org/10.2493/jjspe.82.82
https://doi.org/10.2493/jjspe.82.82
Publikováno v:
Advanced Materials Research. 1136:245-250
The use of hard and brittle materials for manufacturing optical parts, such as dies and molds are required in order to extend mold life. Although, cobalt-free tungsten carbide is one of the hardest materials, micro-cutting is very difficult due to it
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::491eaa3a27645629a9045dfd0aaa0417
https://doi.org/10.4028/www.scientific.net/amr.1136.245
https://doi.org/10.4028/www.scientific.net/amr.1136.245
Autor:
Atsunobu Une, Kenichiro Yoshitomi
Publikováno v:
Journal of the Japan Society for Precision Engineering. 80:815-819
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5855be4662c0a7f46b5723fe91e9ef04
https://doi.org/10.2493/jjspe.80.815
https://doi.org/10.2493/jjspe.80.815