Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Kenichi Shiraishi"'
Autor:
Shohei Okamoto, Kazuki Kamimura, Kenichi Shiraishi, Kazuto Sumita, Kohei Komamura, Akiko Tsukao, Shoko Chijiki, Shinya Kuno
Publikováno v:
Scientific Reports, Vol 11, Iss 1, Pp 1-8 (2021)
Abstract Physical inactivity is a pandemic that requires intensive, usually costly efforts for risk reduction of related chronic diseases. Nevertheless, it is challenging to determine the effectiveness of physical activity in healthcare cost reductio
Externí odkaz:
https://doaj.org/article/d6accb9a91374f67bd29bc303a551d10
Autor:
Kazuki Kamimura, Shohei Okamoto, Kenichi Shiraishi, Kazuto Sumita, Kohei Komamura, Akiko Tsukao, Shinya Kuno
Publikováno v:
International Journal of Economic Policy Studies. 17:95-116
Autor:
Tomohiro Imagawa, Takeshi Tsuka, Tomoki Nakamura, Takehito Morita, Yuji Sunden, Kenichi Shiraishi
Publikováno v:
Journal of Veterinary Medical Science. 81:657-659
A captured Japanese wild boar (Sus scrofa leucomystax) fetus was dicephalic. The fetus had two heads, but one body from the cranial neck region. Computed tomography imaging revealed that the two crania merged at the occipital bone, and the vertebral
Autor:
Tomoki, Nakamura, Yuji, Sunden, Tomohiro, Imagawa, Takeshi, Tsuka, Kenichi, Shiraishi, Takehito, Morita
Publikováno v:
The Journal of Veterinary Medical Science
A captured Japanese wild boar (Sus scrofa leucomystax) fetus was dicephalic. The fetus had two heads, but one body from the cranial neck region. Computed tomography imaging revealed that the two crania merged at the occipital bone, and the vertebral
Autor:
N. Sagawa, Y. Iriuchijima, T. Hayashi, T. Sei, T. Takahiro, K. Nakamura, T. Fujiwara, Kenichi Shiraishi, Hamid R. Khorram, Katsushi Nakano
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 25:63-71
From the initial stages of immersion lithography development, through mainstream manufacturing today, topcoat processes have been utilized. However, the complexity and extra cost associated with the topcoat layer has motivated the industry as a whole
Publikováno v:
2010 12th Electronics Packaging Technology Conference.
We present the results of study on the manufacturability and reliability of ALX211 polymer in wafer level packaging processes and structures. Previously, the processing windows of ALX211 polymer and the impact of the delays between processing steps o
Autor:
Toshiyuki Sekito, Yasuhiro Iriuchijima, Katsushi Nakano, Soichi Owa, Rei Seki, Toshihiko Sei, Yoshihiro Maruta, Tsunehito Hayashi, Tomoharu Fujiwara, Kenichi Shiraishi, Tadamasa Kawakubo
Publikováno v:
SPIE Proceedings.
Double patterning (DP) is the first candidate for extension of ArF immersion lithography, and topcoat-less (TC-less) process is an attractive process candidate compared to a topcoat process because it can make DP process simpler and reduce the chip m
Autor:
Yosuke Shirata, Yuho Kanaya, Yuuki Ishii, Hisashi Nishinaga, Noriaki Kasai, Junichi Kosugi, Kenichi Shiraishi, Shinji Wakamoto
Publikováno v:
SPIE Proceedings.
Double patterning requires extremely high accuracy in overlay and high uniformity in CD control. For the 32 nm half pitch, the CDU budget requires less than 2 nm overlay and less than 2 nm CD uniformity for the exposure tool. To meet these requiremen
Autor:
Masato Yoshida, Kenichi Shiraishi, Soichi Owa, Yasuhiro Iriuchijima, Shiro Nagaoka, Tomoharu Fujiwara, Katsushi Nakano
Publikováno v:
Optical Microlithography XXI.
Volume production of 45nm node devices utilizing Nikon's S610C immersion lithography tool has started. Important to the success in achieving high-yields in volume production with immersion lithography has been defectivity reduction. In this study we
Autor:
Tomoharu Fujiwara, Haiping Zhang, Hiroshi Kato, Irfan Malik, Christine Pelissier, Kenichi Shiraishi, Yasuhiro Iriuchijima, Prasad Terala, Soichi Owa, Steve Woodman, Katsushi Nakano
Publikováno v:
SPIE Proceedings.
ArF immersion lithography has become accepted as the critical layer patterning solution for lithography going forward. Volume production of 55 nm devices using immersion lithography has begun. One of the key issues for the success of volume productio