Zobrazeno 1 - 10
of 90
pro vyhledávání: '"Kengo Iokibe"'
Publikováno v:
IEEE Letters on Electromagnetic Compatibility Practice and Applications. 5:5-9
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c13ba7cb5e25d20f36748a760698fdb
https://doi.org/10.1109/lemcpa.2022.3228199
https://doi.org/10.1109/lemcpa.2022.3228199
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. :1-11
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8a4c79493fc7e9c008afede32c52bdcd
https://doi.org/10.1109/temc.2023.3236674
https://doi.org/10.1109/temc.2023.3236674
Autor:
Kengo Iokibe, Yoshitaka Toyota
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 25:439-445
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::472f9f11794fc223a4728ab604d47ae3
https://doi.org/10.5104/jiep.25.439
https://doi.org/10.5104/jiep.25.439
Publikováno v:
2022 IEEE CPMT Symposium Japan (ICSJ).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bebe466388211c60a041bf9b481738d5
https://doi.org/10.1109/icsj55786.2022.10034727
https://doi.org/10.1109/icsj55786.2022.10034727
Publikováno v:
2022 International Symposium on Electromagnetic Compatibility – EMC Europe.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::751fb25626e8d8baf54e8dd09d3c3fa6
https://doi.org/10.1109/emceurope51680.2022.9901324
https://doi.org/10.1109/emceurope51680.2022.9901324
Publikováno v:
2022 International Symposium on Electromagnetic Compatibility – EMC Europe.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5a533125ee96d2295fc4eb1c0a91189b
https://doi.org/10.1109/emceurope51680.2022.9900948
https://doi.org/10.1109/emceurope51680.2022.9900948
Publikováno v:
IEICE Transactions on Communications. :304-311
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fe3f1ebe3fc42dee3f32e51d72315303
https://doi.org/10.1587/transcom.2020ebp3056
https://doi.org/10.1587/transcom.2020ebp3056
Publikováno v:
IEEJ Transactions on Fundamentals and Materials. 140:586-592
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6c2435fa5439ac0b1db3574b4a460e38
https://doi.org/10.1541/ieejfms.140.586
https://doi.org/10.1541/ieejfms.140.586
Publikováno v:
2021 International Conference on Computer, Communication, Chemical, Materials and Electronic Engineering (IC4ME2).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::25c0f912986758a9cbd9497bf543522d
https://doi.org/10.1109/ic4me253898.2021.9768521
https://doi.org/10.1109/ic4me253898.2021.9768521
Publikováno v:
2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC).
We investigated the possibility of low-cost prediction of side-channel attack (SCA) vulnerability without the need to observe a large number of leakage traces for application to the side-channel attack countermeasure design for cryptographic devices.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ea74e558b5f69b9c28222ae286b1da80
https://doi.org/10.1109/apemc49932.2021.9597127
https://doi.org/10.1109/apemc49932.2021.9597127