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pro vyhledávání: '"Kendra Lyons"'
Autor:
Bong Rosario, Gene Lambird, Paul Makowenskyj, Mohsen Haji-Rahim, Joseph Holyoak, Kendra Lyons, Brian Myers, Shannon Pan, Todd Johnson, Yong Wang
Publikováno v:
International Symposium on Microelectronics. 2019:000100-000102
Cu pillar flip-chip die technology has proved reliable and is widely used in chip-to-package mobile module products. There was a time when customers considered 500ppm (Parts per million) an acceptable defect rate. Now, tier 1 customers expect a defec