Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Ken-Cheng Lu"'
Publikováno v:
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Power modules are widely used to control and convert electrical power system, such as industrial, railway, and even electric vehicle applications. Higher operation temperature and high current density requests of power devices make it is more and mor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fc46b57a5095b085cc613916261486c0
https://doi.org/10.1109/impact50485.2020.9268539
https://doi.org/10.1109/impact50485.2020.9268539
Publikováno v:
2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Power module reliability becomes more and more important than before, especially in the next generation power device. Electric vehicle applications and high temperature operation need better lifetime and environmental resistance. The encapsulated mat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::758c51afb3525c4dfb0eee4459604dbb
https://doi.org/10.1109/impact47228.2019.9024973
https://doi.org/10.1109/impact47228.2019.9024973