Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Ken Hubbard"'
Publikováno v:
Crop Science. 57:595-601
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::40be5a758e9632b181db6362010378ee
https://doi.org/10.2135/cropsci2016.05.0440
https://doi.org/10.2135/cropsci2016.05.0440
Publikováno v:
Journal of Electronic Packaging. 127:290-298
Ball grid array solder joint reliability is known to be dependent on the shape of solder joints after reflow. To ensure good solder joint formation and prevent solder bridging, it is critical to understand the amount of paste volume needed during ass
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fdc85e39ac3fc185af8b2e503881c8de
https://doi.org/10.1115/1.1938985
https://doi.org/10.1115/1.1938985
Autor:
Jie Xue, Mudasir Ahmad, Sue Teng, Judy Priest, Mohan Nagar, Ken Hubbard, Real Pomerleau, John Savic, Percy Aria
Publikováno v:
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
High end networking and computing applications continue to drive silicon technologies for higher data rates and increased bandwidth. The push for silicon performance with 45nm and 32nm devices also drives a need for packaging performance to deliver c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::581aba0a8ba709b6c587dd4e43296c6a
https://doi.org/10.1109/ectc.2010.5490845
https://doi.org/10.1109/ectc.2010.5490845
Publikováno v:
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
Since its introduction in the early 1990s, plastic ball grid array (PBGA) package had become the “package of choice” due to its good electrical performance, lower cost, high assembly yield and self-alignment during board assembly process. Thermo-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8b591819e7c2c8538a9c44e9633e5e55
https://doi.org/10.1109/icept.2009.5270563
https://doi.org/10.1109/icept.2009.5270563
Autor:
Bangalore J. Shanker, Yida Zou, R. Duong, Jie Xue, Wheling Cheng, Ken Hubbard, M. Brillhart, Mudasir Ahmad, S. Priore, Sergio Camerlo
Publikováno v:
Proceedings Electronic Components and Technology, 2005. ECTC '05..
This paper briefly presents how silicon integration and advances in packaging technology have enabled higher performance networking products, and is followed by discussions of how a system-level integrated approach is needed to address the challenges
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a3da3b517eb0945ca61cfe96a4b614db
https://doi.org/10.1109/ectc.2005.1441383
https://doi.org/10.1109/ectc.2005.1441383
Autor:
J. Tang, Ong MeiLin, C. Hallmark, D. Mendez, J. Martinez, P. Li, Ken Hubbard, Chok KengYin, Jie Xue, E. Poh, S. Priore
Publikováno v:
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
A 256Mbit 133MHz clock rate CMOS Double Data Rate Fast Cycle Random Access Memory (DDR FCRAM) SODIMM/sup /spl reg// Module was developed for a high end telecom application. In order to provide a high speed interconnection in between a FCRAM memory mo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68021aeb2b77f28f9b9aa18c44acd4e0
https://doi.org/10.1109/ectc.2004.1319488
https://doi.org/10.1109/ectc.2004.1319488
Publikováno v:
53rd Electronic Components and Technology Conference, 2003. Proceedings..
Long tenn rcliability assessment has been perfoniied on a high perfonnance ASIC using a flip chip HyperBGAB package. considering structural details and incthods of attaching an extcmal heat sink to the package. Various heat sink onachmiicnt inethods
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e2ae6e0ef127196f5f426baf62e6c429
https://doi.org/10.1109/ectc.2003.1216302
https://doi.org/10.1109/ectc.2003.1216302
Publikováno v:
Journal of Electronic Packaging. 128:98-98
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c12f5779fb4b718c0d749120c2a216b3
https://doi.org/10.1115/1.2165648
https://doi.org/10.1115/1.2165648
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