Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Ken Greiner"'
Autor:
Campbell Millar, Salvatore Maria Amoroso, Michael Hargrove, Binjie Cheng, Ken Greiner, Asen Asenov, Louis Gerrer, Razaidi Hussin, David M. Fried, Craig Alexander, Dave Reid, Andrew R. Brown
Publikováno v:
IEEE Transactions on Electron Devices. 62:1739-1745
In this paper we illustrate how the predictive Technology Computer Aided Design (TCAD) process device simulation can be used to evaluate process, statistical, and time-dependent variability at the early stage of the development of new technology. Thi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::58572e605ad37d85cc63a3112893354a
https://doi.org/10.1109/ted.2015.2402440
https://doi.org/10.1109/ted.2015.2402440
Autor:
Mustafa Akbulut, Vasanth Allampalli, Joseph Ervin, Jiangjiang Gu, Andras Pap, Daniel Faken, David M. Fried, Ken Greiner
Publikováno v:
SPIE Proceedings.
The effects of photoresist sidewall profile and LER on two representative integration schemes were studied through 3D virtual fabrication: Front-End of Line (FEOL) Fin formation and Back-End of Line (BEOL) Metal line definition. Both of these process
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::27d03ace546db9aa6885426ebaaebca0
https://doi.org/10.1117/12.2258157
https://doi.org/10.1117/12.2258157
Autor:
Mattan Kamon, Mustafa Akbulut, Daniel Faken, Vasanth Allampalli, Ken Greiner, David M. Fried, Yiguang Yan, Andras Pap
Publikováno v:
SPIE Proceedings.
For Directed Self-Assembly (DSA) to be deployed in advanced semiconductor technologies, it must reliably integrate into a full process flow. We present a methodology for using virtual fabrication software, including predictive DSA process models, to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4ada2a2790f4f0c86aebfdaa3cf27b7d
https://doi.org/10.1117/12.2218935
https://doi.org/10.1117/12.2218935
Publikováno v:
Advanced Etch Technology for Nanopatterning V
For the first time, process impact on line-edge roughness (LER) and line-width roughness (LWR) in a back-end-of-line (BEOL) self-aligned quadruple patterning (SAQP) flow has been systematically investigated through predictive 3D virtual fabrication.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::465123116e48e4f2d428c2a28c2d6e71
Autor:
Andras Pap, Vasanth Allampalli, Mattan Kamon, Daniel Faken, David M. Fried, Ken Greiner, Yiguang Yan, Mustafa Akbulut
Publikováno v:
Journal of Micro/Nanolithography, MEMS, and MOEMS. 15:1
For directed self-assembly (DSA) to be deployed in advanced semiconductor technologies, it must reliably integrate into a full process flow. We present a methodology for using virtual fabrication software, including predictive DSA process models, to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c584c12369b66e4d13435e26acf2c0e
https://doi.org/10.1117/1.jmm.15.3.031605
https://doi.org/10.1117/1.jmm.15.3.031605
Publikováno v:
DAC
Microsystems used for chemical analyses and biological assays are termed BioMEMS or labs-on-a-chip.These systems often require some of the traditional electromechanical capabilities of MEMS,and in addition require the manipulation of fluids in either
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::932dab3d90c0ecaed59499c41905b48c
https://doi.org/10.1145/996566.996736
https://doi.org/10.1145/996566.996736
Publikováno v:
Micro-Electro-Mechanical Systems (MEMS).
Attempts at predicting the squeeze film damping (SQFD) effects in MEMS devices have by and large been restricted to the following approaches; analytic [1] or numerical [3–5] modeling of the Reynolds equation, or numerical solutions of incompressibl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bc40c20b232b84c8e451ac481b7af70d
https://doi.org/10.1115/imece1999-0250
https://doi.org/10.1115/imece1999-0250