Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Kelly Lofgreen"'
Autor:
Ravi Mahajan, Ravi Prasher, Rama Venkatasubramanian, Sridhar Narasimhan, Kelly Lofgreen, Ihtesham Chowdhury, David A. Koester
Publikováno v:
ASME 2009 InterPACK Conference, Volume 2.
We have recently reported the first ever demonstration of active cooling of hot-spots of >1 kW/cm2 in a packaged electronic chip using thin-film superlattice thermoelectric cooler (TEC) cooling technology [1]. In this paper, we provide a detailed acc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2a421dc0a183f62376baecd69fee5d4
https://doi.org/10.1115/interpack2009-89268
https://doi.org/10.1115/interpack2009-89268
Autor:
Kelly Lofgreen, David A. Koester, Ravi Mahajan, Ihtesham Chowdhury, Randall G. Alley, Rama Venkatasubramanian, Gregory M. Chrysler, Ravi Prasher, Sridhar Narasimhan
Publikováno v:
Nature nanotechnology. 4(4)
There is a significant need for site-specific and on-demand cooling in electronic, optoelectronic and bioanalytical devices, where cooling is currently achieved by the use of bulky and/or over-designed system-level solutions. Thermoelectric devices c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c616d866093c3344e2953fedf6eee5e3
https://pubmed.ncbi.nlm.nih.gov/19350027
https://pubmed.ncbi.nlm.nih.gov/19350027
Autor:
Shankar Devasenathipathy, Theodorian Borca-Tasciuc, Swan Johanna M, Ravi Mahajan, Devender, Kelly Lofgreen, Ganpati Ramanath
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 33:060611
Controlling thermal transport across metal–thermoelectric interfaces is essential for realizing high efficiency solid-state refrigeration and waste-heat harvesting power generation devices. Here, the authors report that pnictogen chalcogenides meta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5dbeeb8f42c3da8bc396d0cff99dfc26
https://doi.org/10.1116/1.4935446
https://doi.org/10.1116/1.4935446
Autor:
Ganpati Ramanath, Masashi Yamaguchi, Theodorian Borca-Tasciuc, Devender, Rutvik J. Mehta, Kelly Lofgreen, Ravi Mahajan
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 33:020605
Tailoring electrical and thermal contact conductivities (Σc and Γc) across metallized pnictogen chalcogenide interfaces is key for realizing efficient thermoelectric devices. The authors report that Cu, Ni, Ti, and Ta diffusion and interfacial tell
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::923cad79f44feb5ebcc6995f62f9a984
https://doi.org/10.1116/1.4906573
https://doi.org/10.1116/1.4906573
Publikováno v:
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..
Solid state refrigeration technologies claim no moving parts and could possibly be one of the promising technologies for electronic cooling in the future. This paper focuses on the use of a thin film thermoelectric cooler (TFTEC) directly above the h
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bd709496a56e3513593dc1333514a181
https://doi.org/10.1109/itherm.2006.1645380
https://doi.org/10.1109/itherm.2006.1645380
Publikováno v:
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..
The shrinking transistor feature sizes have resulted broadly in two different packaging thermal challenges; cooling the total thermal design power of the microprocessor, and thermal suppression of the hot spots which have progressively higher heat fl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::581dfbadc9580cb71b9cd912182b6ba8
https://doi.org/10.1109/itherm.2006.1645381
https://doi.org/10.1109/itherm.2006.1645381
Publikováno v:
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..
Decrease in the transistor features have resulted in increased challenges of cooling the hotspots in addition to cooling the overall die. In addition, future packaging concepts of stacked die exacerbate the need for spot-cooling thermal solution. Thi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4a215b167915f05e34cfec370a39f688
https://doi.org/10.1109/itherm.2006.1645382
https://doi.org/10.1109/itherm.2006.1645382
Publikováno v:
Applied Physics Letters. 91:203113
We show that thermal conductivity of packed bed of alumina nanoparticles can be as low as 0.035W∕mK which is only 35% higher than the thermal conductivity of air and is smaller than the recently reported lowest thermal conductivity of solids using
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ce75439e8bccb665e49702884b4e3541
https://doi.org/10.1063/1.2814959
https://doi.org/10.1063/1.2814959