Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.

Specimen-thickness effects on transmission Kikuchi patterns in the scanning electron microscope∗.

Autor: RICE, K.P.¹ (AUTHOR) katherine.rice@nist.gov, KELLER, R.R.¹ (AUTHOR), STOYKOVICH, M.P.² (AUTHOR)

Publikováno v: Journal of Microscopy. Jun2014, Vol. 254 Issue 3, p129-136. 8p. 1 Color Photograph, 3 Black and White Photographs, 1 Chart, 2 Graphs.

Electrical properties of superfilled sub-micrometer silver metallizations.

Autor: Josell, D., Burkhard, C., Li, Y., Cheng, Y.-W., Keller, R.R., Witt, C.A., Kelley, D.R., Bonevich, J.E., Baker, B.C., Moffat, T.P.

Publikováno v: Journal of Applied Physics; 7/1/2004, Vol. 96 Issue 1, p759-768, 10p, 4 Black and White Photographs, 3 Diagrams, 2 Charts, 2 Graphs

Microtexture of Strain in electroplated copper interconnects

Autor: Spolenak, R., Barr, D.L., Gross, M.E., Evans-Lutterodt, K., Brown, W.L., Tamura, N., MacDowell, A.A., Celestre, R.S., Padmore, H.A., Valek, B.C., Bravman, J.C., Flinn, P., Marieb, T., Keller, R.R., Batterman, B.W., Patel, J.R.

Publikováno v: Spolenak, R.; Barr, D.L.; Gross, M.E.; Evans-Lutterodt, K.; Brown, W.L.; Tamura, N.; et al.(2001). Microtexture of Strain in electroplated copper interconnects. Lawrence Berkeley National Laboratory. Lawrence Berkeley National Laboratory: Lawrence Berkeley National Laboratory. Retrieved from: http://www.escholarship.org/uc/item/8mf0v79p

The microstructure of narrow metal conductors in the electrical interconnections on IC chips has often been identified as of major importance in the reliability of these devices. The stresses and stress gradients that develop in the conductors as a r

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=od_______325::2650731d39bf4d2b1cb20877db514f30
http://www.escholarship.org/uc/item/8mf0v79p

Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.