Zobrazeno 1 - 10
of 25
pro vyhledávání: '"Keith Redford"'
Autor:
Dan V. Goia, Helge Kristiansen, Jianying He, Sigurd Rolland Pettersen, Keith Redford, John Njagi, Zhiliang Zhang, Erik Kalland, Susanne Helland
Publikováno v:
Journal of Electronic Materials. 46:4256-4266
Isotropic conductive adhesives (ICAs) are alternatives to metallic solders as interconnects in solar modules and electronic devices, but normally require silver contents >25 vol.% and elevated curing temperatures to achieve reasonable conductivity. I
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::723f4caea9daf65bb417916c360dca2f
https://doi.org/10.1007/s11664-017-5376-1
https://doi.org/10.1007/s11664-017-5376-1
Autor:
Helge Kristiansen, Corinna Grosse, Sigurd Rolland Pettersen, Guillaume Davee, Erik Kalland, Keith Redford, Nina H. Hoglund, Séverine Gomès, Liana Ramiandrisoa, Mohammad Abo Ras, Bruno Hay, Susanne Helland
Publikováno v:
2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Sep 2017, Amsterdam, Netherlands. pp.1-5
2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Sep 2017, Amsterdam, Netherlands. pp.1-5
A novel and low silver content isotropic conductive adhesive (ICA) has been developed and characterised. The conductive particles are based on a silver coated polymer sphere. The thermal properties of the ICAs have been investigated by two different
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d767a69ef89831471776f6c5b3eec41f
https://doi.org/10.1109/therminic.2017.8233820
https://doi.org/10.1109/therminic.2017.8233820
Publikováno v:
2016 6th Electronic System-Integration Technology Conference (ESTC).
This study investigates the volume shrinkage of isotropically conductive adhesives (ICAs), including those filled with silver coated/metallised polymer spheres (Ag-MPS), and the effect of factors such as Ag-MPS volume fraction, adhesive matrix type,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0a17869b1bdb9b2708854a6fd5d9d018
https://doi.org/10.1109/estc.2016.7764486
https://doi.org/10.1109/estc.2016.7764486
Autor:
Erik Kalland, Keith Redford, Zhiliang Zhang, Jianying He, Susanne Helland, Sigurd Rolland Pettersen, Helge Kristiansen
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Replacing the silver flakes in conventional isotropic conductive adhesives (ICAs) with micron sized polymer spheres coated with tens to hundreds nanometer of silver (AgPS) drastically reduces the silver content required to obtain good electrical and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7e14309a87a6d300e68ab87f38cbd3f8
https://doi.org/10.1109/ectc.2016.53
https://doi.org/10.1109/ectc.2016.53
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:002483-002508
As opposed to planar ICs, micro-electro mechanical systems (MEMS) are three dimensional structures with movable parts, membranes and cavities. Fragile movable structures are generally encapsulated inside a cavity by bonding a cap wafer to a MEMS devi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6d13d2630aceeb1dd14632cf1c9d5c7a
https://doi.org/10.4071/2012dpc-tha32
https://doi.org/10.4071/2012dpc-tha32
Publikováno v:
International Symposium on Microelectronics. 2010:000066-000071
Anisotropic conductive adhesives (ACA) are widely used as interconnect materials in the manufacturing of LCD screens. To be integrated in a broader range of interconnect applications several technical and economic issues still need to be addressed. O
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fc3e252e2b76525780ed551a12eb0f13
https://doi.org/10.4071/isom-2010-ta3-paper1
https://doi.org/10.4071/isom-2010-ta3-paper1
Autor:
Helge Kristiansen, M Midttun, Jianying He, Grete Irene Modahl, Keith Redford, Zhiliang Zhang, Geir Fonnum
Publikováno v:
Polymer. 49:3993-3999
A nanoindentation-based flat punch method has been developed to determine the stress–strain behaviour of single micron-sized Ugelstad polystyrene-co-divinylbenzene (PS–DVB) particles in compression. Five groups of particles with identical chemica
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5f0f87d1c03699f8d69250452a9f862c
https://doi.org/10.1016/j.polymer.2008.07.015
https://doi.org/10.1016/j.polymer.2008.07.015
Publikováno v:
The Journal of Adhesion. 84:543-561
Hard anodic layers produced under DC conditions in sulphuric acid on a commercial AA 6060 aluminium alloy have been characterised by electron microscopy and secondary ion mass spectroscopy (SIMS). Once exposed during anodising, α–Al(Fe, Mn)Si inte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::031e5858670cdb34c7b882c6b51daa4e
https://doi.org/10.1080/00218460802161590
https://doi.org/10.1080/00218460802161590
Publikováno v:
Journal of Applied Polymer Science. 106:950-960
Linear isotactic metallocene based polypropylene (Mw = 125,000 g/mol, Mn = 61,000 g/mol) was lightly crosslinked by small amounts of 1,3-benzenedisulfonyl azide to form long chain branches (LCB). Crosslinking was carried out by reactive extrusion at
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::675ae417fb8ad689c46ccd8add8589ee
https://doi.org/10.1002/app.26674
https://doi.org/10.1002/app.26674
Publikováno v:
Polymer. 46:12073-12080
We have studied the thermal decomposition of 1,3-benzenedisulfonyl azide (1,3-BDSA), and verified that sulfonyl nitrenes formed are able to cross-link polyolefins, including PP. The decomposition was studied with DSC, TGA, and the GC–MS analysis of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8106497bd3277bc3143ff87df53a38f1
https://doi.org/10.1016/j.polymer.2005.10.077
https://doi.org/10.1016/j.polymer.2005.10.077