Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Keith J. Hansen"'
Autor:
Sunny Chiang, Jaim Nulman, Keith J. Hansen, Sesh Ramaswami, Murali Narasimhan, Murali Abburi, Vikram Pavate, Glen T. Mori, Daryl Restaino
Publikováno v:
SPIE Proceedings.
Increasing levels of metallization, shrinking device geometries, and stringent defect density requirements have led to a continuous focus in the semiconductor manufacturing community to reduce defects generated during metal deposition by PVD techniqu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::414c3b2e6e57fdb96a0bbb5767b3b406
https://doi.org/10.1117/12.304398
https://doi.org/10.1117/12.304398
Autor:
Sesh Ramaswami, Glen T. Mori, Daryl Restaino, Murali Abburi, Keith J. Hansen, Sunny Chiang, Vikram Pavate, Jaim Nulman, Murali Narasimhan
Publikováno v:
Multilevel Interconnect Technology.
Increasing levels of metallization, shrinking device geometries, and stringent defect density requirements have led to a continuous focus in the semiconductor manufacturing community to reduce defects generated during metal deposition by PVD techniqu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d305a8b3debdb8710c25e8ad893de7fd
https://doi.org/10.1117/12.284663
https://doi.org/10.1117/12.284663