Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Keith Best"'
Autor:
Bryan S. Kasprowicz, Patrick Reynolds, Martin Carrier, Siamak Mogharrabi, Corey Shay, Andrew Zanzal, Keith Best
Publikováno v:
2020 International Wafer Level Packaging Conference (IWLPC).
In the next few years, advanced process technologies in advanced packaging fabs will migrate rapidly to reduction lithography to achieve 2/2 RDL and beyond. Reticle enhancement techniques, such as Optical Proximity Correction (OPC) may be required in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::46429a5a8c2d2daec6eb078a3446b44e
https://doi.org/10.23919/iwlpc52010.2020.9375898
https://doi.org/10.23919/iwlpc52010.2020.9375898
Autor:
Christian Ayala, Kevin Wang, Michael K. Gallagher, Colin Hayes, Corey Shay, Kirk Thompson, Keith Best, Rosemary Bell, Robert K. Barr, Colin Calabrese
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Fifth Generation (5G) network and high speed/high frequency (HS/HF) technology is the key to setting higher transmission rates and improved connectivity but will require significant innovation from materials to enable the manufacturing and performanc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f92904fbd8c4346ddc7bfb940310ce60
https://doi.org/10.1109/ectc32862.2020.00103
https://doi.org/10.1109/ectc32862.2020.00103
Publikováno v:
International Symposium on Microelectronics. 2017:000584-000589
Semiconductor manufacturers are continuously driving efforts to put more computing power and speed into less volume. At the same time, consumers are demanding devices with more functionality that integrate a variety of interconnected circuit types. T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9b3a7c732c88edab2c4ea784a9384532
https://doi.org/10.4071/isom-2017-tha36_058
https://doi.org/10.4071/isom-2017-tha36_058
Autor:
Venky Sundaram, Atsushi Kubo, Chandra Nair, Tomoyuki Ando, Rao Tummala, Corey Shay, Keith Best, Fuhan Liu
Publikováno v:
International Symposium on Microelectronics. 2017:000689-000693
This paper presents the first demonstration of fine pitch embedded trench RDL on glass substrates using a new family of ultra-high resolution dry film photo-sensitive polymer dielectrics and a new large area panel scale lithography tool. The specific
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1fb5cebfa78f7043b2a651ad0cb0894c
https://doi.org/10.4071/isom-2017-thp13_159
https://doi.org/10.4071/isom-2017-thp13_159
Publikováno v:
2019 International Wafer Level Packaging Conference (IWLPC).
The Internet of Things (IOT), mobile devices, memory and automotive applications are major market drivers. These drivers require high performance, low cost, increased functionality and reliability (especially for automotive), 2.5D and 3D packaging so
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::84cebd23d8155753b1f30fd1cf7bf7b7
https://doi.org/10.23919/iwlpc.2019.8913865
https://doi.org/10.23919/iwlpc.2019.8913865
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2017:1-36
For more than 50 years the semiconductor industry has pursued Moore's law, continuously improving device performance, reducing cost, and scaling transistor geometries down to where advanced CMOS has reached beyond the 10nm technology node. The commen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0ba7791800454adcfd3093dfa99718df
https://doi.org/10.4071/2017dpc-wp2_presentation2
https://doi.org/10.4071/2017dpc-wp2_presentation2
Publikováno v:
International Symposium on Microelectronics. 2016:000315-000320
Advanced packaging technologies continue to enable the semiconductor industry to meet the needs for ever thinner, smaller and faster components required in mobile devices and other high performance applications. However, the increase in chip I/O coun
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5e13862aee77bf8da05a9d0786830b62
https://doi.org/10.4071/isom-2016-wp34
https://doi.org/10.4071/isom-2016-wp34
Autor:
Daniel Keith Best, Jessica L. Naber
Publikováno v:
Madridge Journal of Nursing. 1:7-10
Due to the constantly changing environment in healthcare, nurses must be able to adjust their techniques, mindset, and strategies to provide excellent care for their patients. Nurses have to be able to provide emergent care, assess critically ill pat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a55e01bf97a26cc69a24fac1adb5effe
https://doi.org/10.18689/mjn-1000102
https://doi.org/10.18689/mjn-1000102
Autor:
Keith Best, Mike Marshall
Publikováno v:
2018 International Wafer Level Packaging Conference (IWLPC).
As the semiconductor roadmap continues to drive the cost of front-end manufacturing higher in the quest for ever-increasing functionality, manufacturers are looking to the back-end to provide a low cost solution for the final devices. One such soluti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7392ca18a3f84a5ec182bc3818ae8907
https://doi.org/10.23919/iwlpc.2018.8573293
https://doi.org/10.23919/iwlpc.2018.8573293
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2016:001302-001327
Advanced packaging technologies continue to enable the semiconductor industry to meet the needs for ever thinner, smaller and faster components required in mobile devices and other high performance applications. However, the increase in chip I/O coun
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f0bdf8487e5bf273c309c4d61418730
https://doi.org/10.4071/2016dpc-wp16
https://doi.org/10.4071/2016dpc-wp16