Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Keita Kambayashi"'
Publikováno v:
Science and Technology of Advanced Materials: Methods, Vol 4, Iss 1 (2024)
ABSTRACTTo enhance semiconductor efficiency, it is imperative to develop a die-bonding material possessing exceptional thermal conductivity and stress-shielding capabilities to safeguard semiconductor components from detrimental heat and destructive
Externí odkaz:
https://doaj.org/article/2297ddd701734d5f8bcfd2c9652bf6ea
Autor:
Keita KAMBAYASHI1, Nozomu KOGISO1 kogiso@aero.osakafu-u.ac.jp, Takayuki YAMADA2, Kazuhiro IZUI2, Shinji NISHIWAKI2, Masato TAMAYAMA3, Hiroaki Tanaka
Publikováno v:
Transactions of the Japan Society of Aeronautical & Space Science. 2020, Vol. 63 Issue 3, p90-100. 11p.
Autor:
Shinji Nishiwaki, Takayuki Yamada, Keita Kambayashi, Nozomu Kogiso, Masato Tamayama, Kazuhiro Izui
Publikováno v:
Transactions of the Japan Society for Aeronautical and Space Sciences. 63(3):90-100
application/pdf
Transactions of the Japan Society for Aeronautical and Space Sciences. 2020, 63 (3), P.90-100
Transactions of the Japan Society for Aeronautical and Space Sciences. 2020, 63 (3), P.90-100
Autor:
Akari Tsuda, Kazuhiro Izui, Shinji Nishiwaki, Keita Kambayashi, Masato Tamayama, Nozomu Kogiso, Takayuki Yamada
Publikováno v:
AEROSPACE TECHNOLOGY JAPAN, THE JAPAN SOCIETY FOR AERONAUTICAL AND SPACE SCIENCES. 18:151-159
Publikováno v:
The Proceedings of OPTIS. :U00049