Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Keiji Okuma"'
Publikováno v:
Microelectronics Reliability. 39:507-513
The stress-induced voiding (SV) in Al-alloy films with stacked tungsten via structures was investigated. Voids were found in interconnections with stacked and borderless vias that had resistance increase after the aging tests. Failure occurs most fre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0f0ac633038810342e4450b5dfe526b8
https://doi.org/10.1016/s0026-2714(99)00015-3
https://doi.org/10.1016/s0026-2714(99)00015-3
Publikováno v:
Journal of The Electrochemical Society. 142:596-600
A wafer level dielectric breakdown reliability measurement technique using logarithmically stepped-up stress current density is proposed, and the effectiveness of this technique is demonstrated. The stepped current time-dependent dielectric breakdown
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::01fc2d182acc9f0453b6f07c92a33fbd
https://doi.org/10.1149/1.2044106
https://doi.org/10.1149/1.2044106
Publikováno v:
The Proceedings of Mechanical Engineering Congress, Japan. 2015:G1000102
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::47bdfdb7bb91997afc97d2d2ab666d39
https://doi.org/10.1299/jsmemecj.2015._g1000102-
https://doi.org/10.1299/jsmemecj.2015._g1000102-
Publikováno v:
SPIE Proceedings.
The wafer expansion scaling error in overlay accuracy using a stepper has been investigated. The scaling error depends on the exposure energy, mask aperture ratio and wafer surface reflectance. The scaling error is observed only along the X axis when
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7383b05bf0dcedc4f19bc359c2a29845
https://doi.org/10.1117/12.148970
https://doi.org/10.1117/12.148970