Zobrazeno 1 - 10
of 37
pro vyhledávání: '"Kazutomi Mori"'
Publikováno v:
IEICE Transactions on Electronics.
Publikováno v:
IEICE Transactions on Electronics. :559-567
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques. 68:4091-4102
We have proposed a vector-sum phase shifter (VSPS) with a low phase shift error using a tunable active $g_{m}{\text {-}}{C}$ polyphase filter (PPF). The proposed VSPS realizes high insertion gain and a low phase shift error because the tunable active
Autor:
Masaomi Tsuru, Eiji Taniguchi, Kenichi Tajima, Hideyuki Nakamizo, Mitsuhiro Shimozawa, Koji Tsutsumi, Akihito Hirai, Kazutomi Mori
Publikováno v:
IEICE Transactions on Electronics. :547-557
Autor:
Eigo Kuwata, Kazutomi Mori, Masaomi Tsuru, Kazuhiro Maeda, Hidenori, Mitsuhiro Shimozawa, Kiyoshi Ishida, Ishibashi, Kengo Kawasaki, Tomohiro Yao, Hironobu Shibata
Publikováno v:
2020 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT).
This paper describes small size 3D structure SiGe-GaN Tx module using chip embedded substrate. In order to achieve small package size of the Tx module, the GaN device is embedded in the PCB substrate. As the SiGe device and chip inductors are mounted
Autor:
Tsukahara Yasunori, Takeshi Shiode, Hiroshi Fukumoto, Toshio Ishizaki, Koji Yamanaka, Kazuhiro Iyomasa, Yuji Wada, Kazutomi Mori
Publikováno v:
Journal of the Japan Petroleum Institute. 61:163-170
Publikováno v:
2019 IEEE MTT-S International Microwave Symposium (IMS).
A 0.1 to 10 GHz range Digital Frequency Discriminator (DFD) using a Time to Digital Converter and an edge counter adding adaptive control of division ratios of a frequency divider is presented. Wider frequency range can be achieved by automatically c
Autor:
Kiyoshi Ishida, Eigo Kuwata, Kazutomi Mori, Kengo Kawasaki, Mitsuhiro Shimozawa, Hironobu Shibata, Kazuhiro Maeda, Hidenori Ishibashi, Hiroshi Fukumoto, Masaomi Tsuru, Tomohiro Yao
Publikováno v:
2018 13th European Microwave Integrated Circuits Conference (EuMIC).
This paper demonstrates a S-band 3D surface mount packaged Si and GaN Tx Module using flip-chip bonding and a chip embedded PCB Substrate. In order to integrate heterogeneous SiGe and GaN chips in a single package, 3D-structure is employed. The GaN c
Publikováno v:
2018 48th European Microwave Conference (EuMC).
We propose a novel RF front-end architecture to receive 4 signals on different frequency bands with 2 reception paths. The architecture translates 4 RF signal frequencies to 2 intermediate frequencies by utilizing the principle of image rejection mix
Publikováno v:
IEICE Transactions on Electronics. :1498-1507