Zobrazeno 1 - 10
of 33
pro vyhledávání: '"Kazuto Nishida"'
Publikováno v:
Journal of the Japan Society of Powder and Powder Metallurgy. 63:82-84
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6a5a39dcd897841d5ae510d1e7e4da91
https://doi.org/10.2497/jjspm.63.82
https://doi.org/10.2497/jjspm.63.82
Publikováno v:
Materia Japan. 55:18-20
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e59d02fa11da5715039cb74fdb40442d
https://doi.org/10.2320/materia.55.18
https://doi.org/10.2320/materia.55.18
Publikováno v:
Key Engineering Materials. :1828-1833
Anisotropic conductive film (ACF) is commonly used as underfill for flip chip assembly. The present study focuses on elastic recovery and stress distribution along the interfaces of particle-pads and underfill-pads associated with heat or a mechanica
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c83edc3f45c30846e1fba1b69fdfa100
https://doi.org/10.4028/www.scientific.net/kem.297-300.1828
https://doi.org/10.4028/www.scientific.net/kem.297-300.1828
Autor:
Kazuto Nishida, Yuhei Yamashita, Takashi Hojo, Akio Hirose, Yosuke Sogo, Ayako Miwa, Kojiro F. Kobayashi, Atsushi Yamaguchi, Akio Furusawa
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 2:208-216
In this paper we investigate the appropriate reflow profiles for simulated CSP solder joints using Sn-Ag-Bi-In solder, which has a lower melting point than Sn-Ag-Cu solder. We have examined the relationship between the interfacial microstructure and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::02cfeb6ca9ee31322c9822ff8df4281f
https://doi.org/10.4071/1551-4897-2.3.208
https://doi.org/10.4071/1551-4897-2.3.208
Autor:
Kazuto Nishida, Yuhei Yamashita, Takashi Hojo, Akio Hirose, Ayako Miwa, Kojiro F. Kobayashi, Yosuke Sogo, Atsushi Yamaguchi, Akio Furusawa
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 8:44-51
Sn-Ag-Cuはんだよりも融点が低いSn-Ag-Bi-InはんだのBGA接合部の継手特性にっいて, Sn-Zn-Biはんだの継手特性と比較し, その接合部の界面組織と機械的特性の関係について調べ, その適正リフロ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::33ede8128b8ea6719a6eb04ab754dbc0
https://doi.org/10.5104/jiep.8.44
https://doi.org/10.5104/jiep.8.44
Autor:
Atsushi Yamaguchi, Akio Furusawa, Kojiro F. Kobayashi, Takashi Hojo, Yosuke Sogo, Ayako Miwa, Kazuto Nishida, Yuhei Yamashita, Akio Hirose
Publikováno v:
MATERIALS TRANSACTIONS. 45:1282-1289
The lead-free soldering technology has been devoloped all over the world while IEEE ReHS prohibits the use of lead contained solder in 2006. Sn-Ag-Cu solder of which melting point is 219C has the highest solder joints reliability of leadfree solder m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6a82540964e325d9897b1a0335544861
https://doi.org/10.2320/matertrans.45.1282
https://doi.org/10.2320/matertrans.45.1282
Autor:
Takashi Hojo, Yousuke Sogo, Kojiro F. Kobayashi, Atsushi Yamaguch, Kazuto Nishida, Hiroaki Iwanishi, Akio Hirose, Akio Furusawa
Publikováno v:
MATERIALS TRANSACTIONS. 45:734-740
In this study, we used a solder paste of Sn-8Zn-3Bi. The structure and specification of the CSP used in this study are shown in Fig. 1. The composition of the solder ball of the CSP is Sn-3.0Ag-0.5Cu. The CSPs were reflow-soldered on the Cu pad of th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b2f0e3098a81970ea65f29390614d0f
https://doi.org/10.2320/matertrans.45.734
https://doi.org/10.2320/matertrans.45.734
Publikováno v:
Microelectronics Reliability. 43:2065-2075
A high-density packaging technology has been developed that uses new flip-chip bonding technology with a thin IC and a thin substrate. Numerical analysis with the finite element method as well experiments clearly showed that deflection of the IC and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f642c879de7a2785766e4c681db1395e
https://doi.org/10.1016/s0026-2714(03)00166-5
https://doi.org/10.1016/s0026-2714(03)00166-5
Publikováno v:
Journal of Electronic Packaging. 125:414-419
In the present paper, a deformation induced in a new bonding technology of chip-scale package (CSP) using resin encapsulation sheets is examined numerically and experimentally. Deflections after cooling from a bonding temperature are measured experim
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::db5171d52a3cf0d36d7365f5e7e7e94d
https://doi.org/10.1115/1.1602705
https://doi.org/10.1115/1.1602705
Autor:
Takashi Yui, Hajime Honma, Kazuto Nishida, Chie Sasaki, Nobuya Matsumura, Hideo Koguchi, Kouzou Takada, Tomiyo Ema, Izumi Okamoto, Kazumichi Shimizu, Kouji Abe
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 5:693-700
A stacked device called SEP (System Embedded Package) was developed to drastically increase LSI density relative to its area on the circuit board. This was achieved by fabricating an LSI package in a stacked structure. This device has been applied to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2cd741a3028f4a1c8f2d45f580acf2eb
https://doi.org/10.5104/jiep.5.693
https://doi.org/10.5104/jiep.5.693