Zobrazeno 1 - 10
of 19
pro vyhledávání: '"Kazumasa Shimamoto"'
Publikováno v:
Materials, Vol 17, Iss 13, p 3055 (2024)
The purpose of this study was to formulate a mathematical expression for the temperature dependence of adhesive strength using various parameters. Adhesive structures are typically exposed to a broad temperature range, spanning from low to high tempe
Externí odkaz:
https://doaj.org/article/60e5c3cc20ba450cabdffa0e5ce12d67
Publikováno v:
Polymer Testing, Vol 125, Iss , Pp 108141- (2023)
Adhesives used in aircrafts degrade because of moisture. To understand the fractures at the adhesive interface, moisture diffusion coefficients must be estimated, which is challenging and has not yet been reported. In this study, we prepared double c
Externí odkaz:
https://doaj.org/article/6e9d0e9bfbad45b5bed9ccdc543b8b46
Publikováno v:
Materials, Vol 16, Iss 2, p 607 (2023)
Double cantilever beam (DCB) tests were conducted by immersing the specimens in temperature-controlled water while applying a creep load using a spring. By introducing a data reduction scheme to the spring-loaded DCB test method, it was confirmed tha
Externí odkaz:
https://doaj.org/article/f52ead2c253f41f1823a12ca3e2a1694
Autor:
Runa Okumura, Kazumasa Shimamoto, Yu Sekiguchi, Kazushi Kimura, Hirokazu Kageyama, Yutaro Yamamoto, Yuichi Matsuki, Chiaki Sato
Publikováno v:
The Journal of Adhesion. :1-22
Publikováno v:
ACS Applied Materials & Interfaces. 15:9873-9882
Publikováno v:
Fatigue & Fracture of Engineering Materials & Structures. 46:909-923
Publikováno v:
Journal of Applied Polymer Science. 140
Publikováno v:
International Journal of Adhesion and Adhesives. 117:103003
The nano-scale failure behaviors of joint interfaces were investigated by in-situ straining technique to observe the crack propagations in a transmission electron microscope (TEM). The thin sections of bonded interfaces were subjected to tensile load
Publikováno v:
The Proceedings of the Materials and Mechanics Conference. 2022:OS1403
Publikováno v:
The Proceedings of Mechanical Engineering Congress, Japan. 2022:J043-02