Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Kazuhiko Fuse"'
Autor:
N. Hamamoto, Ippei Kobayashi, S. Kato, Hideaki Tanimura, T. Nagayama, Hikaru Kawarazaki, S. Sakai, M. Abe, T. Aoyama, Kazuhiko Fuse, Y. Ito
Publikováno v:
MRS Advances. 2:2921-2926
We report on the formation of shallow junctions with high activation in both n+/p and p+/n Ge junctions using ion implantation and Flash Lamp Annealing (FLA). The shallowest junction depths (Xj) formed for the n+/p and p+/n junctions were 7.6 nm and
Autor:
Hideaki Tanimura, Shinichi Kato, Kazuhiko Fuse, Yoshihide Nozaki, Ippei Kobayasi, Takayuki Aoyama
Publikováno v:
2018 22nd International Conference on Ion Implantation Technology (IIT).
Flash Lamp Annealing (FLA) is a well-known technique for millisecond annealing. In forming ultra-shallow junctions, FLA can provide high activation levels with precise diffusion control in the nanometer range. Currently, devices with 3D structures re
Autor:
Hideaki Tanimura, Kenji Inoue, Shinichi Kato, Takayuki Aoyama, Hikaru Kawarazaki, Ippei Kobayashi, Takahiro Yamada, Kazuhiko Fuse
Publikováno v:
2018 18th International Workshop on Junction Technology (IWJT).
We are developing a new flash lamp annealing (FLA) system featuring flash lamps with short duration and high output power for all CMOS technology nodes including advanced devices. With this system, we can realize lower thermal budgets and higher peak
Autor:
Shinichi Kato, Ippei Kobayashi, Timothee Julien Vincent Blanquart, Hideaki Tanimura, Takayuki Aoyama, Takahiro Yamada, Kazuhiko Fuse, Nadine Collaert
Publikováno v:
2017 17th International Workshop on Junction Technology (IWJT).
In recent years Solid Source Doping (SSD) has been considered as a viable option in fabricating advanced CMOS devices [1], especially for forming shallow and highly doped junctions for source drain extensions (SDE) while minimizing the damage to the
Publikováno v:
2017 17th International Workshop on Junction Technology (IWJT).
We demonstrated the formation of ultra-shallow n+/p junctions in Si using an arsenic-doped Sol-Gel Coating (SGC) (Tokyo Ohka Kogyo Co., Ltd.) [1] and Flash Lamp Annealing (FLA). A high arsenic dopant concentration of 1.2×1020atoms/cm3 (Xj=9.0nm, Rs=
Autor:
Hikaru Kawarazaki, Takahiro Yamada, Kazuhiko Fuse, A. Ueda, Takayuki Aoyama, Y. Ito, Y. Ono, Ippei Kobayashi, Hideaki Tanimura, Shinichi Kato, Hiroshi Onoda, Nariaki Hamamoto, Tsutomu Nagayama, Shigeki Sakai, M. Abe, Masashi Furukawa, Yoshiki Nakashima
Publikováno v:
2016 16th International Workshop on Junction Technology (IWJT).
In this paper, we report on the formation of shallow junctions with high activation in both n+/p and p+/n Ge junctions using ion implantation and Flash Lamp Annealing (FLA). The shallowest junction depths formed for the n+/p and p+/n junctions were 9
Autor:
Kazuhiko Fuse, Masaya Asai, Hiroki Kiyama, Akihiko Morita, Julius Joseph Santillan, Koji Kaneyama, Toshiro Itani
Publikováno v:
SPIE Proceedings.
The reduction of line width roughness (LWR) remains a difficult issue for very fine patterns obtained with extreme ultraviolet (EUV) lithography. Thus, the investigation of LWR-reduction from the viewpoint of resist processing has become necessary. A
Publikováno v:
YAKUGAKU ZASSHI. 98:376-381