Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Kazufuyu Sudoh"'
Autor:
Satoru Iwamori, Shouhei Nozaki, Shin Fukuda, Kazufuyu Sudoh, Nobuhiro Fukuda, Takehiro Miyashita
Publikováno v:
Vacuum. 51:615-618
Copper (Cu) was sputtered onto a polyetheretherketon (PEEK) film and onto three types of polyimide (PI) films; pyromellitic dianhydride-oxydianiline (PMDA-ODA), biphenyl dianhydride- para -phenylene diamine (BPDA-PDA) and biphenyl dianhydride-oxydian
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b932598cf8d71b99b34bef5615e8fa8b
https://doi.org/10.1016/s0042-207x(98)00260-7
https://doi.org/10.1016/s0042-207x(98)00260-7
Autor:
Shin Fukuda, Shouhei Nozaki, Kazufuyu Sudoh, Satoru Iwamori, Nobuhiro Fukuda, Takehiro Miyashita
Publikováno v:
The Journal of Adhesion. 63:309-321
Peel strength between a copper (Cu) thin film and a polyimide (pyromellitic dianhydride-oxydianiline, or PMDA-ODA) substrate is reduced by heat treatment at 150°C in air. In this work, we investigated the peel strength, the morphology of the interfa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::27a262c20fa40f55cb1e2c66abc149c5
https://doi.org/10.1080/00218469708017225
https://doi.org/10.1080/00218469708017225
Autor:
Kazufuyu Sudoh, Shin Fukuda, Shouhei Nozaki, Nobuhiro Fukuda, Satoru Iwamori, Takehiro Miyashita
Publikováno v:
Journal of Adhesion Science and Technology. 11:783-795
The adhesion strength between a copper (Cu) thin film and a polyimide [pyromellitic dianhydride-oxydianiline (PMDA-ODA)] substrate is reduced by heat treatment at 150°C in air. In this work, we determined the changes in adhesion strength between Cu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::567366525d3d8688e9f899be305590ae
https://doi.org/10.1163/156856197x00912
https://doi.org/10.1163/156856197x00912
Publikováno v:
SHINKU. 39:65-70
The adhesive strength between Cu thin films and polyimide (pyromellitic dianhydride-oxydianiline) substrates is known to be reduced after heat treatment at 150°C in air. In order to investigatethe interface between the Cu thin film and polyimide sub
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9fa6587ed74bcb404788b36416f9149b
https://doi.org/10.3131/jvsj.39.65
https://doi.org/10.3131/jvsj.39.65
Publikováno v:
SHINKU. 39:295-301
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7afe8f0cd86c5218ff29e84490679f38
https://doi.org/10.3131/jvsj.39.295
https://doi.org/10.3131/jvsj.39.295
Publikováno v:
SHINKU. 39:11-14
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::72fe2c90282e32903b6840c701fe4a3f
https://doi.org/10.3131/jvsj.39.11
https://doi.org/10.3131/jvsj.39.11
Publikováno v:
SHINKU. 39:103-110
The peel strength of Cu thin film deposited on polyimide substrate is known to be reduced by heat treatment in atmosphere at 150°C. After such heat treatment, Cu2O microparticles were found to have penetrated the polyimide substrate. In order to pre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::76c19794920c427a1eeb6897bd230ebf
https://doi.org/10.3131/jvsj.39.103
https://doi.org/10.3131/jvsj.39.103
Publikováno v:
SHINKU. 39:662-665
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c5aeb6bde31647af103fa03a319c4c9c
https://doi.org/10.3131/jvsj.39.662
https://doi.org/10.3131/jvsj.39.662
Publikováno v:
SHINKU. 39:7-10
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6713894a54311639d7b3bd6e20763e2a
https://doi.org/10.3131/jvsj.39.7
https://doi.org/10.3131/jvsj.39.7
Publikováno v:
SHINKU. 41:278-280
The electronic properties of ITO (Indium Tin oxide) films prepared on PET (polyethylene terephtalate) substrates were investigated. ITO films were deposited with DC magnetron sputtering method using In-Sn alloy target under the condition that the min
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2d888c46bbb8891f89c5b79d78152ecb
https://doi.org/10.3131/jvsj.41.278
https://doi.org/10.3131/jvsj.41.278