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pro vyhledávání: '"Kay Jarchoff"'
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2019:000045-000051
Power electronics is a key technology for the advancement and spreading of electromobility applications and compact power supply devices on the market. The use of new WBG semiconductors (e.g. SiC, GaN) as well as highly integrated silicon-based power
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
Handling the thermal management of electronic assemblies is an important task for engineers and system designers. Currently, the primarily used technology as heat sinks with or without forced convection were used to transfer heat from the component t
Publikováno v:
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
The miniaturization in current power electronics results in an increased heat flux density. Despite the higher power demand, the thermal loss is getting a problem. The energy in form of heat must be dissipated to the environment by convection or ther