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pro vyhledávání: '"Katsuhisa Oosako"'
Autor:
Kazuki Tateyama, Yasunari Ukita, Masao Segawa, Yoshihiko Tojo, Hideyuki Gotoh, Katsuhisa Oosako
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 2:217-222
Lead-free materials are required to replace conventional lead-containing solder for environmental protection. The Pb-rich solder die mount material in a high-power transistor package is required to be replaced by a silver adhesive paste. The silver p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0e6af49f7ef25d0dfa848dfe2fd97a67
https://doi.org/10.4071/1551-4897-2.3.217
https://doi.org/10.4071/1551-4897-2.3.217
