Zobrazeno 1 - 10
of 36
pro vyhledávání: '"Katsuhiro Yoshida"'
Publikováno v:
World Journal of Clinical Cases. 10:3879-3885
Autor:
Toyohiro Aoki, Katsuhiro Yoshida, Takashi Hisada, Shinji Fukumot, Kozo Fujimoto, Koki Nakamura
Publikováno v:
2021 International Conference on Electronics Packaging (ICEP).
In this study, we aimed to optimize process conditions of fine pitch bumping ranging from 20 to 100 micrometer size with eutectic Sn-Bi and Sn-58wt%Bi-2wt%In with less than 1wt% of Pd (referred to as Sn-Bi-In-Pd) solders by Injection Molded Solder (I
Publikováno v:
FUKUSHIMA JOURNAL OF MEDICAL SCIENCE. 63:121-125
A 24-year-old man with severe atopic dermatitis underwent anterior cruciate ligament (ACL) reconstruction of the right knee seven years earlier but developed a surgical site infection. The infection did not heal after removal of the metal implants, a
Autor:
Katsuhiro, Yoshida
Publikováno v:
立教經濟學研究. 67(3):33-53
Autor:
Yohei Matsuo, Jiro Kurata, Miho Sekiguchi, Katsuhiro Yoshida, Takuya Nikaido, Shin-ichi Konno
Publikováno v:
Journal of Anesthesia. 32:311-312
Inadvertently, the Fig. 7 was published incorrectly in the original publication of the article. The correct figure should be as below.
Publikováno v:
旭川大学経済学部紀要 = The journal of Faculty of Economics Asahikawa University. 72:1-19
Publikováno v:
Journal of anesthesia. 31(4)
A considerable portion of chronic low back pain (cLBP) patients lack anatomical abnormality, resist conventional therapeutic interventions, and their symptoms are often complicated with psychological and social factors. Such patients have been report
Publikováno v:
旭川大学経済学部紀要 = The journal of Faculty of Economics Asahikawa University. 70:1-25
Autor:
Dennis Chit Yiu Chan, Vini S. W. Chum, Crystal P. L. Li, Feng Liu, Don Cleary, Jerry Chang, Wenjia Zhou, Connie S. K. Kwong, Maria Anna Rzeznik, Katsuhiro Yoshida, Kristen M. Milum, Dennis Yee
Publikováno v:
2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
This paper describes the development of a new ionic palladium catalyst, CIRCUPOSIT™6530 Catalyst, along with a tartrate-based horizontal electroless copper bath, CIRCUPOSIT™6550, to meet the performance demands of high-density-interconnect (HDI)
Publikováno v:
旭川大学紀要 = The journal of the Asahikawa University. 62:81-99
The purpose of this paper is to discern and to treat accounting of business-combination forms, when the business-combination accounting standard is applied in earnest. The business-combination accounting standard is proclaimed in October 2003 and is