Zobrazeno 1 - 10
of 67
pro vyhledávání: '"Katopis, G."'
Autor:
Stievano, Igor Simone, Chen, Z., Becker, D., Canavero, Flavio G., Grivet-Talocia, S., Katopis, G., Maio, Ivan
Publikováno v:
Proceedings of the 3rd International Workshop on Electromagnetic Compatibility of Integrated Circuits
3rd International Workshop on Electromagnetic Compatibility of Integrated Circuits
3rd International Workshop on Electromagnetic Compatibility of Integrated Circuits, Nov 2002, Toulouse, France. pp. 53-56
3rd International Workshop on Electromagnetic Compatibility of Integrated Circuits
3rd International Workshop on Electromagnetic Compatibility of Integrated Circuits, Nov 2002, Toulouse, France. pp. 53-56
International audience; This paper proposes a macromodeling approach for the simulation of digital interconnected systems. Such an approach is based on a set of macromodels describing IC ports, IC packages and multiconductor interconnect structures i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::c96d1ad1a6d596893953903419109244
http://hdl.handle.net/11583/1409400
http://hdl.handle.net/11583/1409400
Autor:
Katopis, G. A., Becker, W. D., Mazzawy, T. R., Smith, H. H., Vakirtzis, C. K., Kuppinger, S. A., Singh, B., Lin, P. C., Bartells Jr., J., Kihlmire, G. V., Venkatachalam, P. N., Stoller, H. I., Frankel, J. L.
Publikováno v:
IBM Journal of Research & Development. Sep-Nov99, Vol. 43 Issue 5/6, p621. 30p. 1 Color Photograph, 16 Diagrams, 5 Graphs.
Autor:
Zhaoqing Chen, Katopis, G.
Publikováno v:
2009 59th Electronic Components & Technology Conference; 2009, p1106-1113, 8p
Publikováno v:
2007 IEEE Electrical Performance of Electronic Packaging; 2007, p155-158, 4p
Autor:
Zhaoqing Chen, Katopis, G.
Publikováno v:
2004 Electrical Performance of Electronic Packaging; 2004, p185-188, 4p
Publikováno v:
Electrical Performance of Electronic Packaging,; 2002, p333-336, 4p
Publikováno v:
Electrical Performance of Electronic Packaging,; 2002, p329-332, 4p
Publikováno v:
Proceedings 2002 Design, Automation & Test in Europe Conference & Exhibition; 2002, p1044-1048, 5p