Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Katja Keil"'
Publikováno v:
Microelectronic Engineering. 86:2408-2411
For feature sizes smaller than 100nm, proximity effect correction gains more importance in electron beam lithography. Several methods have been proposed for the determination of the proximity parameters, most of them being extensive and time-consumin
Autor:
Monika Boettcher, Lutz Bettin, Holger Sailer, Mathias Irmscher, Tarek Lutz, Johannes Kretz, Karl-Heinz Kliem, Kang-Hoon Choi, Katja Keil, Christoph Hohle, Peter Hahmann, Bernd Schnabel
Publikováno v:
Microelectronic Engineering. 85:778-781
Electron beam direct write (EBDW) provides high resolution for device and technology development. A new variable shaped beam system with improved electron optics was introduced, which features the capability for the 32nm node. Because of the limited
Autor:
Katja Keil, Martin Freitag, Philipp Jaschinsky, Christoph Hohle, Manuela Gutsch, Kang-Hoon Choi
Publikováno v:
SPIE Proceedings.
For shortening the writing time, especially in shaped Electron Beam Direct Writing (EBDW), it is crucial to reduce the number of shapes and the coverage of layout for exposure. The determination of conventional or reversed image printing according to
Autor:
Philipp Jaschinsky, Marc Hauptmann, Katja Keil, Kang-Hoon Choi, Manuela Gutsch, Christoph Hohle, Martin Freitag
Publikováno v:
SPIE Proceedings.
In electron beam lithography, the electron scattering and the corresponding proximity effect highly influence the feature resolution. Especially for sub-100 nm features a compensation for this effect is needed. There are several methods of determinat
Autor:
Christoph Hohle, Arie Jeffrey Den Boef, Marc Hauptmann, Philipp Jaschinsky, Valeriano Ferreras Paz, Uwe Seifert, Johannes Kretz, Manfred Mört, Kang-Hoon Choi, Katja Keil, Laszlo Szikszai, F. Thrum
Publikováno v:
Alternative Lithographic Technologies.
Electron beam direct write (EBDW) can be utilized for developing metrology methods for future technology nodes. Due to its advantage of high resolution and flexibility combined with suitable throughput capability, variable-shaped E-Beam lithography i
Autor:
Katja Keil, Johannes Kretz, R. Zimmermann, M. Tesauro, K.-H. Choi, F. Thrum, Christoph Hohle, Philipp Jaschinsky, R. Schneider
Publikováno v:
25th European Mask and Lithography Conference.
Because of mask cost reduction, electron beam direct write (EBDW) is implemented for special applications such as rapid prototyping or small volume production in semiconductor industry. One of the most promising applications for EBDW is design verifi
Autor:
Katja Keil, Johannes Kretz, Marc Hauptmann, Laurent Pain, Johann W. Bartha, Christophe Constancias
The resolution limit in e-beam lithography is dependent on the resist process, the proximity effect, and the e-beam writer itself. However, it is difficult to distinguish these contributions just by comparing critical dimensions (CDs) of isolated and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6602bd74c532846e2e3f0452fdd52bfa
https://publica.fraunhofer.de/handle/publica/220487
https://publica.fraunhofer.de/handle/publica/220487
Publikováno v:
SPIE Proceedings.
The resolution of a variable shaped beam writer is typically given for the standard geometries like isolated line, isolated space, and dense (1:1) line/space pattern. It is related to the imaging power of both the tool itself as well as the resist pr
Autor:
Johannes Kretz, Roy Zimmermann, M. Tesauro, Kang-Hoon Choi, F. Thrum, Katja Keil, Christoph Hohle, Rok Dittrich, Matthias Goldbach, Thomas Marschner
Publikováno v:
SPIE Proceedings.
Line edge roughness (LER) and line width roughness (LWR) have raised questions and concerns as current lithography techniques reduce critical dimensions (CD) below 50 nm. There are few applications of controlled variation of LER and LWR, even among t
Autor:
M. Richter, M. Kindler, M. Lapidot, Tarek Lutz, D. Zemach, Katja Keil, Christoph Hohle, Johannes Kretz, C. Arndt
Publikováno v:
SPIE Proceedings.
For Electron Beam Direct Write (EBDW) a systematic investigation of defect density using a Negevtech 3100 darkfield inspection system was performed. A special defect learning pattern for memory applications with coverage of 50% was designed and print