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pro vyhledávání: '"Kathy Derksen"'
Autor:
Bryan Rogers, Kathy Derksen, I.C. Ume, Cherif Guirguis, Parimal B. Patel, Aaron Mebane, Vishnu V. B. Reddy, Kola Akinade, Robert Case
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:1219-1226
Unique two-beam laser ultrasonic inspection (LUI) probes were developed for the inspection of the quality of all types of chip packages. Microelectronic assembly houses demand reliable quality inspection tools that can identify all interconnect defec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0d84de031c5438f1916676a5aedb32c0
https://doi.org/10.1109/tcpmt.2019.2911073
https://doi.org/10.1109/tcpmt.2019.2911073
