Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Kathryn C. Rivera"'
Autor:
Vladimir Cherman, Geert Van der Plas, Bartlomiej Jan Pawlak, Eric Beyne, Luke England, Kathryn C. Rivera, Herman Oprins, Martine Baelmans, Tiwei Wei, Zhi Yang
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:415-425
In this article, we design, demonstrate, and characterize a 3-D printed package-level polymer jet impingement cooling solution on a $23\times23$ mm2 thermal test chip. The experimental hardware results for a nozzle pitch of 2 mm show that, with 1-kW
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ff62625689f7a102ce4c8685599e4858
https://doi.org/10.1109/tcpmt.2020.3045113
https://doi.org/10.1109/tcpmt.2020.3045113
Autor:
Zhi Yang, David B. Stone, Janak G. Patel, Kwang Won Choi, Eric W. Tremble, Edmund Blackshear, Kathryn C. Rivera
Publikováno v:
International Symposium on Microelectronics. 2019:000120-000126
Laminates or sequential build-up (SBU) laminate comprised of dielectric materials, metal traces, and metal vias not only serve as the mechanical support for the silicon integrated circuits (ICs), but also electrically connect ICs to ball grid array (
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::01baaa429aa93f2bdfc6b8dc1e58c71c
https://doi.org/10.4071/2380-4505-2019.1.000120
https://doi.org/10.4071/2380-4505-2019.1.000120
Autor:
Herman Oprins, Zhi Yang, Martine Baelmans, Luke England, B. J. Pawlak, Kathryn C. Rivera, Eric Beyne, Vladimir Cherman, Tiwei Wei, G. Van der Plas
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
This work presents, for the first time, a package- level, bare die liquid jet impingement 3D polymer microfluidics heatsink fabricated using 3D printing, or additive manufacturing for large die size and high-power applications. The heatsink achieves
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d60d417f6c7c16a12239307760aaf96d
https://doi.org/10.1109/ectc32862.2020.00225
https://doi.org/10.1109/ectc32862.2020.00225
Autor:
Chenzhou Lian, Frank L. Pompeo, Hsichang Liu, J. Bunt, H. Longworth, Kathryn C. Rivera, Shidong Li, Kamal K. Sikka, Hongqing Zhang
Publikováno v:
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
This paper discusses a thermal reliability testing experiment and failure analysis (FA) in 32nm SOI Si technology chip packages. Thermal performance of the TIM materials is monitored and physical failure analysis is performed on test vehicle packages
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2c4414dc0aa32230b8e185510bb8675b
https://doi.org/10.1109/itherm.2014.6892309
https://doi.org/10.1109/itherm.2014.6892309
Publikováno v:
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
An innovative in-situ electronic package assembly process is presented using the on-chip power to cure the package thermal interface and seal materials and to verify the thermal performance of the electronic package. The in-situ curing process was th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::27ac5d539737643df697519520bb650b
https://doi.org/10.1109/itherm.2008.4544298
https://doi.org/10.1109/itherm.2008.4544298