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pro vyhledávání: '"Kathlene Thomas Reeve"'
Publikováno v:
2018 Pan Pacific Microelectronics Symposium (Pan Pacific).
High-temperature Pb-free solder joints that do not fail during subsequent reflow assembly with low temperature solders are needed for multi-chip modules, die attachments, and other heat resistant applications with high reliability. It is well known t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9e1379021ecd82721e23c6174617e8fe
https://doi.org/10.23919/panpacific.2018.8319020
https://doi.org/10.23919/panpacific.2018.8319020
