Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Karthikeyan Pillai"'
Autor:
Joel A. Bahena, Phillip Tyler, John Taddei, Muthumanickam Sankarapandian, Jamie Prudhomme, Karthikeyan Pillai, Abdullahi Said, Christopher Carr, Dario Goldfarb, Chris Waskiewicz, Qianwen Chen
Publikováno v:
IMAPSource Proceedings. 2022
With the emergence of 3D integration and wafer level packaging, the pillar bumping process has become a critical processing step. As the process has matured, significant efforts have been made for optimization in terms of both production and cost. Th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c0b3774402731c8a85f792b6ca62e626
https://doi.org/10.4071/001c.74626
https://doi.org/10.4071/001c.74626
Autor:
Karthikeyan Pillai, Amit Srivastava, Albert Chan, Sangita Kumari, Christian Witt, Silas Scott, Asha Sharma, Ella Mihevc
Publikováno v:
Particulate Science and Technology. 33:562-566
Cryogenic aerosol cleaning is a dry cleaning method used in the back end of line (BEOL) semiconductor manufacturing to remove defects from planar hydrophobic surfaces such as SiCOH and SiCxNyHz. Cryogenic aerosol cleaning is preferred over convention
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8ea448f499394fb50f0d90b2860ebfe3
https://doi.org/10.1080/02726351.2015.1060655
https://doi.org/10.1080/02726351.2015.1060655
Conference
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Autor:
Dhiman Bhattacharyya, Karthikeyan Pillai, Oliver M. R. Chyan, Liping Tang, Richard B. Timmons
Publikováno v:
Chemistry of Materials; May2007, Vol. 19 Issue 9, p2222-2228, 7p