Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Karoline Bernhard-Höfer"'
Publikováno v:
International Symposium for Testing and Failure Analysis.
This presentation covers the basic physics needed to understand and to effectively apply backside IC analysis techniques to flip-chip packaged die. It describes the principles of light transmission through silicon and the factors that influence optic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::41939e47f7584e77225b53170f709364
https://doi.org/10.31399/asm.cp.istfa2022tpg1
https://doi.org/10.31399/asm.cp.istfa2022tpg1
Publikováno v:
International Symposium for Testing and Failure Analysis.
This presentation covers the basic physics needed to effectively apply backside IC analysis techniques to flip-chip packaged die. It describes the principles of light transmission through silicon and the factors that influence optical image formation
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e823c5dbdf48d5e84d40496e13cf45bc
https://doi.org/10.31399/asm.cp.istfa2021tpg1
https://doi.org/10.31399/asm.cp.istfa2021tpg1