Výsledky vyhledávání - "Karmjit Singh Sandha"

Delay analysis of mixed CNT bundles as global interconnect for nanotechnology nodes

Autor: Gurleen Dhillon, Karmjit Singh Sandha

Publikováno v: Journal of Electrical Engineering. 74:57-63

This paper presents modeling of high current capability of mixed carbon nanotube (CNT) bundle interconnects depending upon the type of constituent CNT materials and their orientations. With different arrangements, one category of novel mixed CNT bund

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::46e09199575edd26463fc47e11cc9f09
https://doi.org/10.2478/jee-2023-0007

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Impact of Thickness and wt% on the Dielectric Properties of Sugarcane Bagasse and MWCNT Composite Material as Microwave Absorber

Autor: Anju Tripathi, Karmjit Singh Sandha

Publikováno v: Waste and Biomass Valorization. 14:2009-2024

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::f569b783fd78725b1566eea78848078e
https://doi.org/10.1007/s12649-022-01977-6

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GA based optimized graphene antenna design for detection of explosives and drugs using THz spectroscopy

Autor: Gurjeevan Singh, Karmjit Singh Sandha, Ankush Kansal

Publikováno v: Micro and Nanostructures. 179:207566

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::d4030c655f9e3fe559a42a768262873a
https://doi.org/10.1016/j.micrna.2023.207566

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Analytical Delay Model and Stability Analysis for MLGNR Interconnects

Autor: Himanshu Sharma, Karmjit Singh Sandha

Publikováno v: Journal of Circuits, Systems and Computers. 31

This paper analyzes the signal delay and relative stability of multilayer graphene nanoribbon (MLGNR) interconnects dependent on temperature at global lengths. A thermally aware driver interconnect load (DIL) system, constituted by equivalent single

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::f86850688222f2e61deb92459b55e298
https://doi.org/10.1142/s0218126622502607

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Investigation on the combined effects of variable Fermi energies and temperatures on the performance of multilayer graphene nanoribbon as interconnects

Autor: Himanshu Sharma, Karmjit Singh Sandha

Publikováno v: Analog Integrated Circuits and Signal Processing. 104:157-168

In the present research, the Fermi energy and temperature-dependent performance of a multilayer graphene nanoribbon (MLGNR) in terms of signal delay and power delay product (PDP) at the global interconnect length for three different technology nodes

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::a321edff83aa5cd854be0c535cc2b923
https://doi.org/10.1007/s10470-020-01681-2

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Stability- and Crosstalk-Based Performance of Multi- and Double-walled Mixed CNT Bundles as Interconnect for Next-Generation Technology Nodes

Autor: Gurleen Dhillon, Karmjit Singh Sandha

Publikováno v: Journal of Circuits, Systems and Computers. 31

The temperature-dependent modeling technique (in the temperature range of 200–500[Formula: see text]K) for a mixed class of carbon nanotube (CNT) bundle interconnects is proposed. The equivalent single conductor (ESC) transmission line models of mu

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::11b5f10016f93ec4be2b7aa796f41b09
https://doi.org/10.1142/s0218126622500980

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Thermally-Aware Modeling and Performance Analysis of Mixed-MWCNTB as Very Large Scale Integrated Interconnects Material for Nano-Electronic Integrated Circuits Design

Autor: Pardeep Kumar Jindal, Karmjit Singh Sandha

Publikováno v: Journal of Nanoelectronics and Optoelectronics. 14:1255-1266

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::1148733adbcd8325b93f55c43ffd4205
https://doi.org/10.1166/jno.2019.2635

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Thermally Aware Modeling and Performance Analysis of MLGNR as On-Chip VLSI Interconnect Material

Autor: Karmjit Singh Sandha, Himanshu Sharma

Publikováno v: Journal of Electronic Materials. 48:4902-4912

In this study, a thermally aware electrical equivalent single conductor along with an analytical model to evaluate the parasitic parameters of multilayer graphene nanoribbon (MLGNR) as an on-chip very-large-scale integration interconnect is proposed

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::95edb94d8fc1a452e9de7e0de3456f8d
https://doi.org/10.1007/s11664-019-07281-9

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Comparative Analysis of Mixed CNTs and MWCNTs as VLSI Interconnects for Deep Sub-micron Technology Nodes

Autor: Arvind Thakur, Karmjit Singh Sandha

Publikováno v: Journal of Electronic Materials. 48:2543-2554

This research paper presents a performance analysis of the mixed carbon nanotube (CNT) as an interconnect for very large-scale integration (VLSI) circuits at deep sub-micron (DSM) technology nodes. The mixed CNT interconnect is a combination of multi

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::3a8e0873d31062fdec6bf1039d321838
https://doi.org/10.1007/s11664-019-06930-3

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