Zobrazeno 1 - 10
of 176
pro vyhledávání: '"Karlheinz Bock"'
Autor:
Chin-Hao Tsai, Han-Tang Hung, Fu-Ling Chang, Steffen Bickel, Maik Müller, Iuliana Panchenko, Karlheinz Bock, C.R. Kao
Publikováno v:
Journal of Materials Research and Technology, Vol 19, Iss , Pp 2510-2515 (2022)
Sn/In–Sn bonding interfaces obtained by the transient liquid phase (TLP) reaction were investigated for applications in low-temperature assembly. Bonding was achieved at temperatures below 150 °C with a low bonding pressure. Although a few voids w
Externí odkaz:
https://doaj.org/article/bde3abed5e674d75829b65c5057afe1b
Publikováno v:
Materials, Vol 7, Iss 11, Pp 7226-7242 (2014)
In this work, the insulating properties of poly(4-vinylphenol) (PVP) and SU-8 (MicroChem, Westborough, MA, USA) dielectrics are analyzed and compared with each other. We further investigate the performance behavior of organic field-effect transistors
Externí odkaz:
https://doaj.org/article/c5f861234d6346db9914a3789a5cb3f2
Autor:
Martin Schubert, Jens Rasche, Mika-Matti Laurila, Tiina Vuorinen, Matti Mäntysalo, Karlheinz Bock
Publikováno v:
Materials, Vol 12, Iss 17, p 2713 (2019)
Medical treatment is increasingly benefiting from biomedical microsystems, especially the trending telemedical application. A promising modality for tumor therapy showed the application of nanosecond pulsed electric fields (nsPEF) on cells to achieve
Externí odkaz:
https://doaj.org/article/f96403b3586b4ea7a044b7ce49e1a947
Autor:
Martin Schubert, Martin Schmidt, Paul Wolter, Hagen Malberg, Sebastian Zaunseder, Karlheinz Bock
Publikováno v:
Materials, Vol 11, Iss 1, p 19 (2017)
Telemedicine focuses on improving the quality of health care, particularly in out-of-hospital settings. One of the most important applications is the continuous remote monitoring of vital parameters. Long-term monitoring of biopotentials requires ski
Externí odkaz:
https://doaj.org/article/1e9ebaa0de704d0b9d7cda2057aa3061
Autor:
Christof Strohhöfer, Gerhard Klink, Michael Feil, Andreas Drost, Dieter Bollmann, Dieter Hemmetzberger, Karlheinz Bock
Publikováno v:
Measurement + Control, Vol 40 (2007)
Externí odkaz:
https://doaj.org/article/8a2fa7ae3ffd4f42959c6498c242fbf8
Autor:
Prashant Kumar Singh, Kashi Vishwanath Machani, Dirk Breuer, Michael Hecker, Karsten Meier, Frank Kuechenmeister, Marcel Wieland, Karlheinz Bock
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e6c64941bb20aec42fc42cb89fc9be04
https://doi.org/10.1109/eurosime56861.2023.10100826
https://doi.org/10.1109/eurosime56861.2023.10100826
Autor:
Viktor Dudash, Kashi Vishwanath Machani, Bjoern Boehme, Simone Capecchi, Jungtae Ok, Karsten Meier, Frank Kuechenmeister, Marcel Wieland, Karlheinz Bock
Publikováno v:
2023 IEEE International Reliability Physics Symposium (IRPS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::edf2163a01793d0ae6284d27a0f30830
https://doi.org/10.1109/irps48203.2023.10117636
https://doi.org/10.1109/irps48203.2023.10117636
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7a0239bf17f569c5427ede780b28119f
https://doi.org/10.1109/eptc56328.2022.10013121
https://doi.org/10.1109/eptc56328.2022.10013121
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::275878dcb2b4c45301e601ab33c3755d
https://doi.org/10.1109/estc55720.2022.9939534
https://doi.org/10.1109/estc55720.2022.9939534
Autor:
Philip Knoch, Karsten Meier, Robin Schulze, Christian Endisch, Ludwig Reichel, Maria Esche, Karlheinz Bock
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c711a80c0697284ac22cc0d5cc6cf9bd
https://doi.org/10.1109/estc55720.2022.9939433
https://doi.org/10.1109/estc55720.2022.9939433