Zobrazeno 1 - 10
of 25
pro vyhledávání: '"Karl J. L. Geisler"'
Publikováno v:
RF and Microwave Semiconductor Device Handbook ISBN: 9781315220314
The challenges posed by high chip heat fluxes and ever more stringent performance and reliability constraints make thermal management a key enabling technology in the development of microelectronic systems for the twenty-first century. Thus, thermal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f550e30f8fe30b1b77aeaf89c5c85893
https://doi.org/10.1201/9781420039979-14
https://doi.org/10.1201/9781420039979-14
Publikováno v:
Encyclopedia of Thermal Packaging. :399-412
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c351932a3d2a98972b8281e749941554
https://doi.org/10.1142/9789814678063_bmatter
https://doi.org/10.1142/9789814678063_bmatter
Publikováno v:
Encyclopedia of Thermal Packaging. :i-xix
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c26b6e0f04d1ac9ea2b48f5cbaf91439
https://doi.org/10.1142/9789814678063_fmatter
https://doi.org/10.1142/9789814678063_fmatter
Publikováno v:
SID Symposium Digest of Technical Papers. 46:670-672
A novel luminaire architecture based on LCD display light management technologies is described. Results from prototype lighting systems demonstrate directional control capabilities comparable to lensed LED arrays, but with large uniformlyemitting sur
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f82f3dfd78f96b67933ec01ab160c711
https://doi.org/10.1002/sdtp.10260
https://doi.org/10.1002/sdtp.10260
Publikováno v:
SID Symposium Digest of Technical Papers. 46:667-669
3M Optical Films deliver brightness, energy performance and color enhancement to liquid crystal displays. A key challenge to adapting these technologies to lighting is transforming thin films to three dimensional components. Results highlight new fil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::880a60e25ce94674e8bb774580852ddf
https://doi.org/10.1002/sdtp.10259
https://doi.org/10.1002/sdtp.10259
To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management a
Autor:
Shweta Natarajan, Karl J. L. Geisler
Publikováno v:
Journal of Thermal Science and Engineering Applications. 8
Critical heat flux (CHF) of the fluoroketone fluid FKE-774 in vertical microgap channels is explored, with a focus on submillimeter spacings. Experiments were conducted using a 20 mm × 20 mm heated aluminum surface. Microgap channel spacings were de
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c2486690eec8a0a62cedaad13e9ad5c1
https://doi.org/10.1115/1.4031931
https://doi.org/10.1115/1.4031931
Autor:
Karl J. L. Geisler, Avram Bar-Cohen
Publikováno v:
Mechanical Engineering. 133:38-41
This article discusses findings of some immersion cooling studies carried out to define the potential of direct liquid cooling of three-dimensional chip stacks. Four possible immersion cooling strategies were assessed. These included two active cooli
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::21d3471d8c7a698f0d2888acdf0da068
https://doi.org/10.1115/1.2011-apr-3
https://doi.org/10.1115/1.2011-apr-3
Autor:
Avram Bar-Cohen, Karl J. L. Geisler
Publikováno v:
International Journal of Heat and Mass Transfer. 52:2427-2436
Pool boiling and CHF experiments were performed for vertical, rectangular parallel-plate channels immersed in the dielectric liquid FC-72 at atmospheric pressure to elucidate the effects of geometrical confinement in immersion cooled electronics appl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::71cead9806fb4a1cee6287f1549d07fb
https://doi.org/10.1016/j.ijheatmasstransfer.2009.02.001
https://doi.org/10.1016/j.ijheatmasstransfer.2009.02.001
Publikováno v:
Encyclopedia of Thermal Packaging ISBN: 9789814327602
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::73a8d93d5db8ca8f6248cff757f14596
https://doi.org/10.1142/9789814678063_0009
https://doi.org/10.1142/9789814678063_0009