Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Karim Bennedine"'
Autor:
Rakesh K. Singh, Raghava Kakireddy, Karim Bennedine, Andrew Galpin, Xiaomin Wei, Alain Chabourel, Ara Philipossian, Christopher Wargo, Claude Reversat, Joseph E. Smith
Publikováno v:
MRS Proceedings. 1249
The focus of this work is wafer retaining rings and their impact on chemical mechanical planarization (CMP) process stability, yield, and overall cost of ownership (CoO). The study looks at various CMP retaining ring materials and processing methods.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aaa1a7d61ecab64d8f8543d1d3f076fd
https://doi.org/10.1557/proc-1249-e02-01
https://doi.org/10.1557/proc-1249-e02-01
Autor:
Nicolas Pic, Karim Bennedine, Guray Tas, Dario Alliata, Jana Clerico, David G. Seiler, Alain C. Diebold, Robert McDonald, C. Michael Garner, Dan Herr, Rajinder P. Khosla, Erik M. Secula
Publikováno v:
AIP Conference Proceedings.
Chemical mechanical planarization (CMP) is a critical process for creating high performance interconnected structures. If line structures are under polished, residual copper or barrier will short out the circuitry resulting in defective dies. However
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2667430e7341d1786e35757bcec87b0b
https://doi.org/10.1063/1.2799398
https://doi.org/10.1063/1.2799398