Zobrazeno 1 - 2
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pro vyhledávání: '"Kari Kulojärvi"'
Autor:
Kari Kulojärvi, Jorma K. Kivilahti
Publikováno v:
Microelectronics International. 15:16-19
A new under bump metallurgy (UBM) solution consisting of the TiW‐, Au‐ and Ni‐layers for solder flip chip applications has been developed. The metallurgy, being based on the well‐known TAB metallisation procedure, was modified by producing th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1eae4f58c15d848712b76a4dc34a5393
https://doi.org/10.1108/13565369810370328
https://doi.org/10.1108/13565369810370328
Publikováno v:
Microelectronics International. 15:20-24
The dissolution processes and subsequent intermetallic reactions between high tin solder bump alloys and Cu‐ or Ni‐based UBM‐metallisations were investigated both theoretically and experimentally. The results showed that when the Cu UBM layer i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1fa43f2b7231f8317e3cf3fc43b64934
https://doi.org/10.1108/13565369810215582
https://doi.org/10.1108/13565369810215582