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pro vyhledávání: '"Karen H. Brown"'
Autor:
Karen H. Brown
Using critical race theory and Freire's theoretical framework of oppression as a guide, this chapter discusses institutionalized oppression through the lens of the chapter's author. She provides a collection of lived experiences in the form of short
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::10101705d864361c5e1cff270e72d506
https://doi.org/10.4018/978-1-5225-5942-9.ch003
https://doi.org/10.4018/978-1-5225-5942-9.ch003
Autor:
Karen H. Brown
Publikováno v:
SPIE Proceedings.
Electronics has been the nation’s largest and fastest growing manufacturing industry throughout the end of the last century. Semiconductors have fueled that growth , even with the downturn in the past two years. The US semiconductor industry now ha
Autor:
Daniel J. Fleming, Roxann L. Engelstad, Edward G. Lovell, Brent Edward Boerger, Gerald A. Dicks, Karen H. Brown
Publikováno v:
SPIE Proceedings.
A new fabrication process flow is being developed for X-ray lithography masks to simplify the wafer bonding procedure while allowing for the use of a standard, non-distortive mount in the e-beam tool. A conventional flow includes a support ring that
Autor:
Karen H. Brown
Publikováno v:
The 1998 international conference on characterization and metrology for ULSI technology.
The semiconductor industry continues to move forward aggressively to make more productive wafers and lower cost per function in its products. The National Technology Roadmap for Semiconductors (NTRS) follows Moore’s Law of four times the number of
Autor:
Karen H. Brown
Publikováno v:
SPIE Proceedings.
In 1994, The National Technology Roadmap for Semiconductors was revised, updated to reflect the latest information, and published in December 1994. Lithography continues to be a cornerstone for semiconductor process and productivity. The roadmap acti
Autor:
Karen H. Brown
Publikováno v:
SPIE Proceedings.
This paper sets a framework for those which follow. The National Lithography Roadmap has been enhanced in 1994 to include a systems approach to lithographic requirements. The lithography specifications at the wafer level which will be required in the
Autor:
Karen H. Brown
Publikováno v:
Extreme Ultraviolet Lithography.
The leading edge product in today’s semiconductor manufacturing is the 16M DRAM. Most manufacturers are into at least their first shrink and in many cases their second shrink generation with minimum critical dimensions in the 0.4-0.45μm range. The
Autor:
Karen H. Brown
Publikováno v:
African Arts. 33:11
Publikováno v:
African Arts. 33:13
Autor:
Karen H. Brown, Jean Morris
Publikováno v:
African Arts. 29:99