Zobrazeno 1 - 10
of 137
pro vyhledávání: '"Karel Dusek"'
Autor:
Alena Pietrikova, Daniel Dzivy, Peter Provazek, Lubomir Livovsky, Robert Dzunda, Karel Dusek, David Busek
Publikováno v:
Applied Surface Science Advances, Vol 18, Iss , Pp 100483- (2023)
In this study, the effects of nonstandard near-eutectic SnAg surfaces on the wettability, intermetallic compound growth and mechanical properties of solder joints were investigated. Four types of surface finishes based on near-eutectic SnAg alloys wi
Externí odkaz:
https://doaj.org/article/e0b8a1e6325549778893c92a3109e6c4
Publikováno v:
Sensors, Vol 24, Iss 8, p 2601 (2024)
In this paper, the design and research of a sensor-based personal air-quality monitoring device are presented, which is retrofitted into different personal protective face masks. Due to its small size and low power consumption, the device can be inte
Externí odkaz:
https://doaj.org/article/0266c3b8e7984ce6894071f97b4c7aa5
Publikováno v:
Welding in the World. 67:1347-1355
Voids inside solder joints are empty spaces negatively affecting the mechanical, thermal, and electrical properties of the solder joint. This article deals with this problematics using two novel approaches to reduce voids’ occurrence. The first app
Autor:
David Busek, Karel Dusek
Publikováno v:
2022 45th International Spring Seminar on Electronics Technology (ISSE).
Autor:
Karel Dusek, Petr Vesely, Denis Fros, Martin Kozak, Kristina Sorokina, Zbynek Plachy, David Busek, Jaroslav Dusek, Iva Kralova, Marketa Klimtova, Martin Placek
Publikováno v:
2022 45th International Spring Seminar on Electronics Technology (ISSE).
Autor:
Zbynek Plachy, Karel Dusek
Publikováno v:
2022 45th International Spring Seminar on Electronics Technology (ISSE).
Publikováno v:
2022 45th International Spring Seminar on Electronics Technology (ISSE).
Autor:
Eduard Marius Lungulescu, Petr Vesely, Radu Setnescu, Pavel Mach, Petru V. Notingher, Karel Dusek, Martin Horák, Cristina Stancu
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:1647-1656
A rapid method based on activation energy values for the lifetime assessment of PP films used as dielectrics for capacitors is proposed. The activation energy is determined from a nonisothermal measurement made by differential scanning calorimetry an
Publikováno v:
Journal of Materials Science: Materials in Electronics. 31:16314-16323
The kinetics of Sn whisker growth was investigated on vacuum-evaporated Sn thin-films. Sn film layers were deposited on a Cu substrate with 0.5 and 1 µm thicknesses. The samples were stored in room conditions (22 ± 1 °C/50 ± 5RH%) for 60 days. Th
Publikováno v:
Soldering & Surface Mount Technology. 32:219-223
Purpose The purpose of this paper is to investigate the effect of different viscosity models (Cross and Al-Ma’aiteh) and different printing speeds on the numerical results (e.g. pressure over stencil) of a numerical model regarding stencil printing