Zobrazeno 1 - 10
of 149
pro vyhledávání: '"Karel Dusek"'
Autor:
Alena Pietrikova, Daniel Dzivy, Peter Provazek, Lubomir Livovsky, Robert Dzunda, Karel Dusek, David Busek
Publikováno v:
Applied Surface Science Advances, Vol 18, Iss , Pp 100483- (2023)
In this study, the effects of nonstandard near-eutectic SnAg surfaces on the wettability, intermetallic compound growth and mechanical properties of solder joints were investigated. Four types of surface finishes based on near-eutectic SnAg alloys wi
Externí odkaz:
https://doaj.org/article/e0b8a1e6325549778893c92a3109e6c4
Publikováno v:
Sensors, Vol 24, Iss 8, p 2601 (2024)
In this paper, the design and research of a sensor-based personal air-quality monitoring device are presented, which is retrofitted into different personal protective face masks. Due to its small size and low power consumption, the device can be inte
Externí odkaz:
https://doaj.org/article/0266c3b8e7984ce6894071f97b4c7aa5
Publikováno v:
Materials, Vol 11, Iss 10, p 1931 (2018)
In this paper, the surface area of coated polymer-based textiles, i.e., copper and nickel plated woven polyester fabric, copper and acrylic coated woven polyester fabric, and copper and acrylic coated non-woven polyamide fabric, is investigated. In o
Externí odkaz:
https://doaj.org/article/b061db87e21b4ba5b06da3524c9b66e7
Publikováno v:
Welding in the World. 67:1347-1355
Voids inside solder joints are empty spaces negatively affecting the mechanical, thermal, and electrical properties of the solder joint. This article deals with this problematics using two novel approaches to reduce voids’ occurrence. The first app
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a85a80e19dbe12d89b7f89c34823841e
https://doi.org/10.1007/s40194-023-01505-7
https://doi.org/10.1007/s40194-023-01505-7
Autor:
David Busek, Karel Dusek
Publikováno v:
2022 45th International Spring Seminar on Electronics Technology (ISSE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e865295cbf51b88f60f63c3800f866b3
https://doi.org/10.1109/isse54558.2022.9812779
https://doi.org/10.1109/isse54558.2022.9812779
Autor:
Karel Dusek, Petr Vesely, Denis Fros, Martin Kozak, Kristina Sorokina, Zbynek Plachy, David Busek, Jaroslav Dusek, Iva Kralova, Marketa Klimtova, Martin Placek
Publikováno v:
2022 45th International Spring Seminar on Electronics Technology (ISSE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ffbab2085faeb18f751299731282482
https://doi.org/10.1109/isse54558.2022.9812772
https://doi.org/10.1109/isse54558.2022.9812772
Autor:
Zbynek Plachy, Karel Dusek
Publikováno v:
2022 45th International Spring Seminar on Electronics Technology (ISSE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e316406aec92e02c09b0f8d6e5c7393f
https://doi.org/10.1109/isse54558.2022.9812783
https://doi.org/10.1109/isse54558.2022.9812783
Publikováno v:
2022 45th International Spring Seminar on Electronics Technology (ISSE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::de12dff12a5f7bfb254179390648a729
https://doi.org/10.1109/isse54558.2022.9812708
https://doi.org/10.1109/isse54558.2022.9812708
Autor:
Eduard Marius Lungulescu, Petr Vesely, Radu Setnescu, Pavel Mach, Petru V. Notingher, Karel Dusek, Martin Horák, Cristina Stancu
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:1647-1656
A rapid method based on activation energy values for the lifetime assessment of PP films used as dielectrics for capacitors is proposed. The activation energy is determined from a nonisothermal measurement made by differential scanning calorimetry an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cfca4bb4289523d1b46669c64380bf85
https://doi.org/10.1109/tcpmt.2020.3019275
https://doi.org/10.1109/tcpmt.2020.3019275
Publikováno v:
Journal of Materials Science: Materials in Electronics. 31:16314-16323
The kinetics of Sn whisker growth was investigated on vacuum-evaporated Sn thin-films. Sn film layers were deposited on a Cu substrate with 0.5 and 1 µm thicknesses. The samples were stored in room conditions (22 ± 1 °C/50 ± 5RH%) for 60 days. Th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed664548a756dde1db7e8b62032848f2
https://doi.org/10.1007/s10854-020-04180-2
https://doi.org/10.1007/s10854-020-04180-2