Zobrazeno 1 - 10
of 539
pro vyhledávání: '"Karel DUŠEK"'
Autor:
Agata Skwarek, Halim Choi, Tamás Hurtony, Jaeduk Byun, Ahmad Azmin Mohamad, David Bušek, Karel Dušek, Balázs Illés
Publikováno v:
Nanomaterials, Vol 14, Iss 20, p 1636 (2024)
This study investigates the mechanism and effects of incorporating different ZrO2 nano-particles into SAC0307 solder alloys. ZrO2 nano-powder and nano-fibers in 0.25–0.5 wt% were added to the SAC0307 alloy to prepare composite solder joints by surf
Externí odkaz:
https://doaj.org/article/56374fb45aa448f5aa0a5b7afd415d22
Publikováno v:
Virtual and Physical Prototyping, Vol 18, Iss 1 (2023)
3D-printed electronics belong to new approaches to how to build a complex object with multiple desired functions. For that purpose, materials with specific electric properties are needed: conductors, insulators, magnetics, or dielectrics with high pe
Externí odkaz:
https://doaj.org/article/d8fd712bb22344c8942eb4798babee2c
Publikováno v:
Journal of Materials Research and Technology, Vol 20, Iss , Pp 4231-4240 (2022)
The main joining process of the electronic industry is still soldering with different alloys of Sn. This work studied the relationship between Sn whisker growth and corrosion resistance of 99Sn0.3Ag0.7Cu–TiO2/ZnO (0.25wt%) composite solder alloys i
Externí odkaz:
https://doaj.org/article/b89dad20fd34482daca066ea9c86c613
Publikováno v:
Case Studies in Thermal Engineering, Vol 36, Iss , Pp 102173- (2022)
The work evaluates the impact of latent heat (LH) absorbed or released by a solder alloy during melting or solidification, respectively, on changes of dimensions of materials surrounding of the solder alloy. Our sample comprises a small printed circu
Externí odkaz:
https://doaj.org/article/f8507e8d6759443f8aa57364715c1d19
Publikováno v:
Metals, Vol 12, Iss 1, p 121 (2022)
Sn–Bi alloys are desirable candidates for soldering components on printed circuit boards (PCBs) because of their low melting point and reduced cost. While certain tin–bismuth solders are well characterized many new alloys in this family have been
Externí odkaz:
https://doaj.org/article/df3e82efe9c94800b19ecd44db1faa77
Publikováno v:
Horticultural Science, Vol 44, Iss 1, Pp 49-52 (2017)
The Czech collection of shallot (Allium cepa var. ascalonicum) genetic resources (122 accessions) was surveyed for the presence of four different viruses, i.e. Onion yellow dwarf virus, Leek yellow stripe virus, Garlic common latent virus (GCLV), and
Externí odkaz:
https://doaj.org/article/02cad85b250e4d94ba0224f27786d4c5
Publikováno v:
Journal of Manufacturing Processes. 81:696-706
Publikováno v:
Ceramics International.
Akademický článek
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