Zobrazeno 1 - 10
of 33
pro vyhledávání: '"Kareem Madkour"'
Autor:
Aliaa Kabeel, Sutae Kim, Young Gook Park, Donggyun Kim, Joe Kwan, Sarah Rizk, Kareem Madkour, Marwa Shafee, Jinhee Kim
Publikováno v:
DTCO and Computational Patterning II.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::46ccf129547c41e1009f9b7e6e59a88c
https://doi.org/10.1117/12.2658350
https://doi.org/10.1117/12.2658350
Publikováno v:
Proceedings of the 2022 ACM/IEEE Workshop on Machine Learning for CAD.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ad268dd64ada70f3f4bd2f03bbc88524
https://doi.org/10.1145/3551901.3556479
https://doi.org/10.1145/3551901.3556479
Publikováno v:
Design-Process-Technology Co-optimization XV.
In the semiconductor fabrication process, yield is negatively impacted by defects that appear systematically within specific patterns of the physical layout design. Those defective patterns are popularly known as hotspots, and they can arise due to v
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7738f3eab938ce40d9a17637745548cf
https://doi.org/10.1117/12.2586265
https://doi.org/10.1117/12.2586265
Autor:
Nabil Sabry, Sherif Hammouda, Sarah Risk, Joe Kwan, Mostafa Alaa, Wael El-Manhawy, Kareem Madkour, SeungJo Lee, Jongha Park, Marwah Shafee, Aliaa Kabeel, Mohamed Bahnasawi, Abdelrahman Abdelrazek, Jin Hee Kim
Publikováno v:
Design-Process-Technology Co-optimization for Manufacturability XIV.
At the core of Design-technology co-optimization (DTCO) processes, is the Design Space Exploration (DSE), where different design schemes and patterns are systematically analyzed and design rules and processes are co-optimized for optimal yield and pe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::936816e58b6c28572b6513f6cf00aca2
https://doi.org/10.1117/12.2551916
https://doi.org/10.1117/12.2551916
Publikováno v:
ICCAD
Extensive technology scaling has not only increased the complexity of Integrated Circuit (IC) fabrication but also multiplied the challenges in the Design For Manufacturability (DFM) space. Among these challenges, detection of design weak-points, pop
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a06f55c614cd9ef0ec626641b0dc787a
https://doi.org/10.1109/iccad45719.2019.8942128
https://doi.org/10.1109/iccad45719.2019.8942128
Autor:
Ira Leventhal, Ghada Sokar, Yassien Zakaria, Xinli Gu, Jochen Rivoir, Kareem Madkour, Asmaa Rabie, Haralampos-G. Stratigopoulos
Publikováno v:
VTS
2019 IEEE 37th VLSI Test Symposium, VTS 2019
2019 IEEE 37th VLSI Test Symposium, VTS 2019
Over the last decade there has been a surge of activity in employing advanced statistical analysis and machine learning methods to various test-related tasks. The topic is no longer simply a matter of academic curiosity but, rather, a pressing need o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3097ea7c2785e40fd91e56756a8e8fdb
https://research.tue.nl/en/publications/d80e8461-e420-4852-a77c-00b22b78c079
https://research.tue.nl/en/publications/d80e8461-e420-4852-a77c-00b22b78c079
Autor:
Jae-Hyun Kang, Aliaa Kabeel, Namjae Kim, Sangah Lee, Wael ElManhawy, Marwah Shafee, Sangwoo Jung, Asmaa Rabie, Kareem Madkour, Ahmed ElGhoroury, Seung Weon Paek, Joe Kwan, Ki-Heung Park, Jiwon Oh
Publikováno v:
Design-Process-Technology Co-optimization for Manufacturability XIII.
As the typical litho hotspot detection runtime continue to increase with sub-10nm technology node due to increasing design and process complexity, many DFM techniques are exploring new methods that can expedite some of their advanced verification pro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6e13a5caba02a84fbb7cb58fe50d3c67
https://doi.org/10.1117/12.2515139
https://doi.org/10.1117/12.2515139
Publikováno v:
VTS
The IP session focuses on using Machine Learning (ML) techniques on several emerging applications. The first contribution discusses hotspot detection by using ML. The second presentation then talks a data-driven health monitoring solution. The last c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f3d64afd8be0c31e6520297985151b3b
https://doi.org/10.1109/vts.2018.8368654
https://doi.org/10.1109/vts.2018.8368654
Autor:
Zhengfang Liu, Xinyi Hu, Kareem Madkour, Qijian Wan, Joe Kwan, Guogui Deng, Aliaa Kabeel, Shirui Yu, Meili Zhang, Gensheng Gao, Wael ElManhawy, Mudan Wang, Chunshan Du
Publikováno v:
Design-Process-Technology Co-optimization for Manufacturability XII.
As the IC technology node moves forward, critical dimension becomes smaller and smaller, which brings huge challenge to IC manufacturing. Lithography is one of the most important steps during the whole manufacturing process and litho hotspots become
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::42ccc04d9e3a51cedd6bd419f660473d
https://doi.org/10.1117/12.2297296
https://doi.org/10.1117/12.2297296
Autor:
Park Seong-Yul, Sooryong Lee, Kareem Madkour, Joe Kwan, Ho-Kyu Kang, Seung-Hune Yang, Joong-Won Jeon, SeungJo Lee, Jaewan Song, Wael ElManhawy, Jeong-Lim Kim
Publikováno v:
SPIE Proceedings.
Due to limited availability of DRC clean patterns during the process and RET recipe development, OPC recipes are not tested with high pattern coverage. Various kinds of pattern can help OPC engineer to detect sensitive patterns to lithographic effect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fbe03e1331cf338d750fc4c3b7d06483
https://doi.org/10.1117/12.2257830
https://doi.org/10.1117/12.2257830