Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Kanji Takagi"'
Publikováno v:
Journal of Thermal Science and Technology, Vol 6, Iss 1, Pp 164-177 (2011)
This paper describes the results of experimental and analytical work on a phase-changematerial(PCM)-based transient cooling module. The module is made of low-cost materials, yet it is designed to achieve a reasonably high level of heat transfer perfo
Externí odkaz:
https://doaj.org/article/2a1f01541c5149e9a2b99d2b9cb65bfe
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 12:636-642
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 12:643-650
本報では,車載電装部品において疲労信頼性が最も重要視されるチップ部品の実装プロセスが及ぼすはんだ接合部の形状への影響を調べるため,実験結果との一致性の高い鉛フリーはん
Autor:
KAZUHIKO, SUZUKI, MARIKO, HENMI, TAKUSHI, NANBA, KATSUKO, SASAI, KANJI, TAKAGI, MASAKO, ASANO, KOUJI, TAKAGI, MAYUMI, HAYASHI, TAKAYO, SASAGAWA, MISAKO, OKITA
Publikováno v:
岡山県立大学保健福祉学部紀要. 5:77-85
岡山県南西部に位置する地方都市である、倉敷市在往、成人の栄養および生活活動の実態調査を行った。対象は年齢20才代から60才代の男子227名女子253名であった。栄養摂取量は簡易半定
Publikováno v:
2012 14th International Conference on Electronic Materials and Packaging (EMAP).
In this paper, authors proposed an original sensor which can measure thermal fatigue life of electronic equipment. The measurement principle of the sensor is that the joint was damaged by the stress due to a mismatch of thermal expansion between two
Publikováno v:
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1.
This paper proposes the high reliable design method for lead-free solder joint on metal substrate on chip component. First, the crack propagation analysis method for estimating rupture life of solder joint was constructed. And then, the effect of mat
Publikováno v:
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
This paper presents the high reliability design method for lead-free solder joints on chip components, and that is able to evaluate effect of soldering process for solder joint shape. Coupled analysis of structure analysis and flow analysis was propo
Publikováno v:
ASME 2009 InterPACK Conference, Volume 2.
The miniaturization and high reliability for automotive electronic components has been strongly requested. Generally, electronic component and printed wiring board are connected using solder joint. The reliability of solder joint has widely dispersio
Publikováno v:
ASME 2009 InterPACK Conference, Volume 2.
This paper describes transient cooling technology for electronic equipment using Phase Change Materials (PCMs) and a heat sink with pin fins. We designed an electronic module including paraffin as the PCM and measured its transient temperature rise.
Publikováno v:
Okayama Igakkai Zasshi (Journal of Okayama Medical Association). 102:1261-1265