Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Kamotesov, Sergkei"'
Publikováno v:
Proceedings of the IEEE MTT-S Wireless Power Transfer Conference
2019 IEEE WPTC
2019 IEEE WPTC, Jun 2019, London, United Kingdom. pp.WPP24
2019 IEEE WPTC
2019 IEEE WPTC, Jun 2019, London, United Kingdom. pp.WPP24
Omni-directional inductive wireless power transfer to a movable target inside a half-meter cubic emitter box is studied. The innovative point is to use 3D Molded Interconnect Device (3D-MID) coils at the surface of the target with a 3D shape. Transmi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::446bd8661a56694401b4042daa51d325
https://doi.org/10.1109/wptc45513.2019.9055702
https://doi.org/10.1109/wptc45513.2019.9055702
Autor:
Kamotesov, Sergkei
Publikováno v:
Electronique. Université de Lyon, 2019. Français. ⟨NNT : 2019LYSE1353⟩
The objective of this thesis is to evaluate the interest of 3D molded interconnect devices technologies 3D-MID for wireless power transfer (WPT) through electromagnetic induction. WPT systems mostly uses planar coils that allows transfer between rece
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::89e2373f05169d16ed56d45f803689c9
https://theses.hal.science/tel-02496934
https://theses.hal.science/tel-02496934
Publikováno v:
2018 13th International Congress Molded Interconnect Devices (MID)
2018 13th International Congress Molded Interconnect Devices (MID), Sep 2018, Würzburg, Germany. ⟨10.1109/ICMID.2018.8526962⟩
2018 13th International Congress Molded Interconnect Devices (MID), Sep 2018, Würzburg, Germany. ⟨10.1109/ICMID.2018.8526962⟩
International audience; Omnidirectional inductive wireless charging system of a mobile is studied. Instead of using conventional planar coils printed on circuit boards, 3D Molded Interconnect Device (3D-MID) coils are used. The receiver is a single p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::14bba753c4fd04b4cabd6cea818dd4b8
https://hal.archives-ouvertes.fr/hal-02152067/document
https://hal.archives-ouvertes.fr/hal-02152067/document
Autor:
Lombard, Philippe, Cabrera, Michel, Semet, Vincent, ALLARD, Bruno, Kamotesov, Sergkei, Moguedet, Maël, Charmeau, J-Y
Publikováno v:
Journal sur l'enseignement des sciences et technologies de l'information et des systèmes
Journal sur l'enseignement des sciences et technologies de l'information et des systèmes, EDP Sciences, 2017, 16, pp.1013. ⟨10.1051/j3ea/20171013⟩
Journal sur l'enseignement des sciences et technologies de l'information et des systèmes, EDP Sciences, 2017, 16, pp.1013. ⟨10.1051/j3ea/20171013⟩
National audience; Dans un contexte concurrentiel accru, les industries doivent développer de nouvelles solutions pour répondre à des défis majeurs (innovation, design, fonctionnalité, consommation…). La plastronique, qui est au confluent des
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::d38689c1996e791efb0f1fd0cabe684c
https://hal.archives-ouvertes.fr/hal-02411149
https://hal.archives-ouvertes.fr/hal-02411149
Autor:
Kamotesov, Sergkei, Lombard, Philippe, Vollaire, Christian, Semet, Vincent, Cabrera, Michel, Dahmani, Rabah, Veille, Amaury, Moguedet, Ma?l
Publikováno v:
2016 12th International Congress Molded Interconnect Devices (MID); 2016, p1-6, 6p