Výsledky vyhledávání - "Kamil-Paul Rataj"

Ultrathin, Substrate-Integrated, and Self-Healing Nanocapacitors With Low-Leakage Currents and High-Operating Frequencies

Autor: Rao Tummala, Christopher Schnitter, Nathan Neuhart, Markondeya Raj Pulugurtha, Kamil-Paul Rataj, Himani Sharma, Shubham Jain, Parthasarathi Chakraborti, Saumya Gandhi

Publikováno v: IEEE Transactions on Components, Packaging and Manufacturing Technology. 6:1776-1784

This paper describes ultrathin tantalum-based high-volumetric-density power capacitors with low leakage properties for 1–10-MHz frequency applications. Nanodielectrics with low-defect density were grown on nanoporous tantalum anodes using the self-

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::4c724e81a74b43bd7f1726577268adb8
https://doi.org/10.1109/tcpmt.2016.2602213

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Fabrication and Integration of Ultrathin, High-Density, High-Frequency Ta Capacitors on Silicon for Power Modules

Autor: Rao Tummala, Naomi Lollis, Christoph Schnitter, Nathan Neuhart, Himani Sharma, P. M. Raj, Kamil-Paul Rataj, Saumya Gandhi, Frank Stepniak, Matthew D. Romig, Parthasarathi Chakraborti

Publikováno v: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

This paper demonstrates silicon-integrated, thinfilm, high-density tantalum capacitors for integrated power modules. The capacitors in form-factors of less than 75µm showed stable capacitance densities of more than 0.3 µF/mm2 with leakage of less t

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::100fa4c6fb222f3c0c793fdcac2d40d8
https://doi.org/10.1109/ectc.2016.270

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Demonstration of ultra-thin tantalum capacitors on silicon substrates for high-frequency and high-efficiency power applications

Autor: Himani Sharma, Saumya Gandhi, Pulugurtha Markondeya Raj, Kamil-Paul Rataj, Rao Tummala, Parthasarathi Chakraborti

Publikováno v: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

This paper describes an innovative scheme for integrating thinfilm tantalum (Ta) capacitors on active silicon substrates, an approach that can serve as a roadmap for the potential integration of ultra-thin high density capacitors in near future. The

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::5ff5962446bc1b54378e46bbb7d62fdd
https://doi.org/10.1109/ectc.2015.7159917

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