Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Kamil-Paul Rataj"'
Autor:
Rao Tummala, Christopher Schnitter, Nathan Neuhart, Markondeya Raj Pulugurtha, Kamil-Paul Rataj, Himani Sharma, Shubham Jain, Parthasarathi Chakraborti, Saumya Gandhi
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 6:1776-1784
This paper describes ultrathin tantalum-based high-volumetric-density power capacitors with low leakage properties for 1–10-MHz frequency applications. Nanodielectrics with low-defect density were grown on nanoporous tantalum anodes using the self-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c724e81a74b43bd7f1726577268adb8
https://doi.org/10.1109/tcpmt.2016.2602213
https://doi.org/10.1109/tcpmt.2016.2602213
Autor:
Rao Tummala, Naomi Lollis, Christoph Schnitter, Nathan Neuhart, Himani Sharma, P. M. Raj, Kamil-Paul Rataj, Saumya Gandhi, Frank Stepniak, Matthew D. Romig, Parthasarathi Chakraborti
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
This paper demonstrates silicon-integrated, thinfilm, high-density tantalum capacitors for integrated power modules. The capacitors in form-factors of less than 75µm showed stable capacitance densities of more than 0.3 µF/mm2 with leakage of less t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::100fa4c6fb222f3c0c793fdcac2d40d8
https://doi.org/10.1109/ectc.2016.270
https://doi.org/10.1109/ectc.2016.270
Autor:
Himani Sharma, Saumya Gandhi, Pulugurtha Markondeya Raj, Kamil-Paul Rataj, Rao Tummala, Parthasarathi Chakraborti
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
This paper describes an innovative scheme for integrating thinfilm tantalum (Ta) capacitors on active silicon substrates, an approach that can serve as a roadmap for the potential integration of ultra-thin high density capacitors in near future. The
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ff5962446bc1b54378e46bbb7d62fdd
https://doi.org/10.1109/ectc.2015.7159917
https://doi.org/10.1109/ectc.2015.7159917
Autor:
Chakraborti, Parthasarathi, Sharma, Himani, Pulugurtha, Markondeya Raj, Tummala, Rao R., Rataj, Kamil-Paul, Schnitter, Christopher, Neuhart, Nathan, Jain, Shubham, Gandhi, Saumya
Publikováno v:
IEEE Transactions on Components, Packaging & Manufacturing Technology; Dec2016, Vol. 6 Issue 12, p1776-1784, 9p
Publikováno v:
2015 IEEE 65th Electronic Components & Technology Conference (ECTC); 2015, p1-36, 36p