Reduction of warpage occurrence on stack-die QFN using FEA and statistical method.

Autor: Abdullah, I., Ahmad, I., Talib, M. Z. M., Kamarudin, M.N. B. C.

Publikováno v: 2008 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT); 2008, p1-5, 5p