Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Kamalesh K. Srivastava"'
Publikováno v:
Advanced Flip Chip Packaging ISBN: 9781441957672
Since the invention of flip chip technology by IBM about 40 years ago, there has been a continuous need for increased I/O density. More recently fine pitch technology is being enabled in Pb-free through Cu pillar and Sn–Ag solders. Stiffer Pb-free
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f26a71a5bff35fd230faaee388109731
https://doi.org/10.1007/978-1-4419-5768-9_2
https://doi.org/10.1007/978-1-4419-5768-9_2
Publikováno v:
CICC
IBMpsilas C4 interconnection technology has continuously evolved over a period of forty years, i.e. from evaporation, to electroplating to C4NP, a C4 New Process. IBMpsilas initial C4NP efforts are focused on Sn-based Pb-free solder technology, in li
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::42564ac585a722eb7fd8dcbc1814d851
https://doi.org/10.1109/cicc.2008.4672025
https://doi.org/10.1109/cicc.2008.4672025
Publikováno v:
2008 58th Electronic Components and Technology Conference.
Detailed observations of the impact of various process parameters on the fracture of brittle structures in low-k dielectric flip chips assembled on organic laminates using lead-free metallurgies are reported. Specifically, a simple model is first pre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ac1eca5303d0c8241a2c4748788bb5fe
https://doi.org/10.1109/ectc.2008.4549954
https://doi.org/10.1109/ectc.2008.4549954
Autor:
Hai P. Longworth, Harry D. Cox, D. Hawken, John J. Garant, Valerie Oberson, J. Shah, Kamalesh K. Srivastava, Eric D. Perfecto
Publikováno v:
2008 58th Electronic Components and Technology Conference.
As a part of IBM movement from Pb-rich solders to Pb-free solder, a new low cost process has been developed to deposit the solder to a capture, or under bump metal (UBM) pad, with Suss MicroTech Inc as the equipment partner. The controlled collapsed
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::07bf0d8435d79c1b9216bdd8d93e2ebd
https://doi.org/10.1109/ectc.2008.4550197
https://doi.org/10.1109/ectc.2008.4550197
Autor:
D. Restaino, Sarah H. Knickerbocker, R. Volant, Takashi Hisada, S. Allard, S. McKnight, Kamalesh K. Srivastava, Kevin S. Petrarca, Tien Cheng, Frederic Beaulieu, Wolfgang Sauter
Publikováno v:
56th Electronic Components and Technology Conference 2006.
Nickel and gold are electrodeposited on wire bond pads by a newly developed selective plating process in which plating is done without photoresist. The gold terminal metal offers exciting advantage over the traditional aluminum metallurgy. The unique
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::236f056dc6777081dbfe20c038f63de5
https://doi.org/10.1109/ectc.2006.1645922
https://doi.org/10.1109/ectc.2006.1645922
Conference
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Publikováno v:
Proceedings, 39th Electronic Components Conference; 1989, p901-904, 4p
Autor:
Tong, H.-M., Yeh, H.L., Goldblatt, R.D., Srivastava, K.K., Coffin, J.T., Rosenberg, W.D., Jaspal, J.S.
Publikováno v:
Proceedings, 39th Electronic Components Conference; 1989, p539-543, 5p
Publikováno v:
IEEE Transactions on Components, Hybrids & Manufacturing Technology; 1993, Vol. 16 Issue 5, p571-576, 6p
Autor:
Tong, H.-M., Yeh, H.L., Goldblatt, R.D., Srivastava, K.K., Coffin, J.T., Rosenberg, W.D., Jaspal, J.S.
Publikováno v:
IEEE Transactions on Electron Devices; 1989, Vol. 36 Issue 8, p1521-1527, 7p