Zobrazeno 1 - 10
of 49
pro vyhledávání: '"Kamal K. Sikka"'
Autor:
Kamal K. Sikka, Hiroyuki Mori, Hongqing Zhang, Ravi K. Bonam, Risa Miyazawa, Keiji Matsumoto, Marc A. Bergendahl, Takashi Hisada, Aakrati Jain, Dario L. Goldfarb, Dishit P. Parekh, Ed Cropp, Saraf Iqbal Rashid
Publikováno v:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
In a previous study [1], the authors have investigated stacked silicon microcoolers and quantified their thermal performance envelope in a separable format where the microcooler is attached to an electronic package lid with an intervening TIM2. In th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::69c443acf3198537049b6a613d530acf
https://doi.org/10.1109/itherm51669.2021.9503180
https://doi.org/10.1109/itherm51669.2021.9503180
Autor:
Maryse Cournoyer, Hiroyuki Mori, Ravi K. Bonam, Marc A. Bergendahl, Paul S. Andry, Dishit P. Parekh, Isabel de Sousa, Kamal K. Sikka, Aakrati Jain, Pascale Gagnon, Rama Divakaruni, Thomas A. Wassick, Ed Cropp, Hongqing Zhang, Yang Liu, Sayuri Kohara, Catherine Dufort
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
We introduce a new packaging technology termed as Direct Bonded Heterogeneous Integration (DBHi) where a Si-bridge is directly bonded to and in between processor chips using Cu pillars, allowing high-bandwidth low-latency low-power communication betw
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::960ccc6b8b26dfdd3b11d507ce84411f
https://doi.org/10.1109/ectc32696.2021.00034
https://doi.org/10.1109/ectc32696.2021.00034
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In this paper, we present a predictive model created using Artificial Neural Networks (ANN). ANN is used to develop approximate models that mimic the overall package mechanical behavior. Furthermore, the approximate ANN models can be efficiently coup
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4bf52cd2056bbb6104d63c561917337c
https://doi.org/10.1109/ectc32696.2021.00230
https://doi.org/10.1109/ectc32696.2021.00230
Autor:
Mark Christian Mueller, Jeroen van Borkulo, Kees Biesheuvel, Roman Doll, Dishit P. Parekh, Juan-Manuel Gomez, Kamal K. Sikka, Aakrati Jain, Marc A. Bergendahl
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
The recently introduced Direct Bonded Heterogeneous Integration (DBHi) Si bridge technology has chips connected by a bridge housed inside a cavity or trench that is precisely machined in the chip-carrier laminate. The size, thickness, and placement c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b56f3ffb798a898fa44912828a0d70b9
https://doi.org/10.1109/ectc32696.2021.00184
https://doi.org/10.1109/ectc32696.2021.00184
Publikováno v:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
With increasing processing capability and power consumption in multi-layered micro-electronic packages, efficient thermal management and structural integrity continue to remain crucial factors for ensuring package reliability. Effective and simple to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::794bae518a69d422dd22ae4d750edfc0
https://doi.org/10.1109/itherm51669.2021.9503285
https://doi.org/10.1109/itherm51669.2021.9503285
Publikováno v:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Using silicon for microcooler fabrication is advantageous over metals as it can be micromachined for smaller fin wall and channel width dimensions, increasing the thermal heat transfer coefficient [1], [2]. Since the fin height is limited by the wafe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::81f4d1bb7ffead46a6ff872f6030b918
https://doi.org/10.1109/itherm51669.2021.9503164
https://doi.org/10.1109/itherm51669.2021.9503164
Publikováno v:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Thermal analysis is used to predict operating temperatures in electronic packages. Thermal analysis is deterministically conducted using finite element, control volume, finite difference, or analytical methods. Input parameters include package geomet
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a08d61b9cd2baff9bf678af0d0f86d17
https://doi.org/10.1109/itherm51669.2021.9503167
https://doi.org/10.1109/itherm51669.2021.9503167
Autor:
Keiji Matsumoto, Hiroyuki Mori, Sayuri Kohara, Marc A. Bergendahl, Kamal K. Sikka, Takashi Hisada
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
The recently introduced Direct Bonded Heterogeneous Integration (DBHi) Si bridge technology [1] consists of chips directly connected by a bridge chip though Cu pillars, enabling high speed and high band-width communication between CPUs, GPUs and memo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::70a36e225d53777abecb0f4f4b24ba88
https://doi.org/10.1109/ectc32696.2021.00222
https://doi.org/10.1109/ectc32696.2021.00222
Publikováno v:
Volume 1: Additive Manufacturing; Advanced Materials Manufacturing; Biomanufacturing; Life Cycle Engineering; Manufacturing Equipment and Automation.
A three-dimensional (3D) transient finite element formulation for modeling laser processing is presented, with the capability to simulate both additive manufacturing and laser ablation physics. State variables are introduced to model the phase change
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::609d040334254aa48eec468733b01f14
https://doi.org/10.1115/msec2020-8319
https://doi.org/10.1115/msec2020-8319
Autor:
Ahmad R. Gharaibeh, Yaser Hadad, Scott N. Schiffres, Charles L. Arvin, Cong Hiep Hoang, Kamal K. Sikka, Srikanth Rangarajan, Najmeh Fallahtafti, Bahgat Sammakia
Publikováno v:
Applied Thermal Engineering. 198:117453
Jet impingement two-phase cooling is often used to handle the high heat fluxes of high-performance electronics. While much of the literature focuses on thermal–hydraulic performance, the effects of fin geometry on the two-phase heat transfer and pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f37fcac7481af6f401e14fc87b063a2e
https://doi.org/10.1016/j.applthermaleng.2021.117453
https://doi.org/10.1016/j.applthermaleng.2021.117453