Design and migration challenges for an Alpha microprocessor in a 0.18 μm copper process.

Autor: Hokinson, R., Benschneider, B., Arneborn, M., Clay, D., Clouser, J., Dumford, S., Kalathur, V., Kalidindi, V., Kovvali, S., Krause, J., Maresh, S., Munger, B., O'Neill, N., Pragaspathy, I., Qin, W., Sasamori, R., Sayadi, S., Singh, T., Tang, J., Tracz, M.

Publikováno v: 2001 IEEE International Solid-State Circuits Conference. Digest of Technical Papers. ISSCC (Cat. No.01CH37177); 2001, p320-460, 3p