Zobrazeno 1 - 10
of 78
pro vyhledávání: '"Kailin Pan"'
Publikováno v:
Frontiers in Materials, Vol 11 (2024)
The shear fatigue performance and fracture behavior of microscale ball grid array (BGA) structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints with different heights (500 μm, 300 μm, and 100 μm) with increasing current density (from 6.0 × 103 to 1.1 × 104
Externí odkaz:
https://doaj.org/article/1062984c36354127a596809d82af965a
Publikováno v:
Symmetry, Vol 15, Iss 9, p 1739 (2023)
The nozzle-matrix gas flow velocity has a great influence on the accuracy of the temperature field of a printed circuit board assembly (PCBA) during the hot air convection reflow soldering process. This paper proposes a new approach that integrates t
Externí odkaz:
https://doaj.org/article/aad53d4576374ba8996b09854f09e8c5
Publikováno v:
Crystals, Vol 12, Iss 1, p 85 (2022)
The shear performance and fracture behavior of microscale ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints with increasing electric current density (from 1.0 × 103 to 6.0 × 103 A/cm2) at various test temperatures (25 °C, 55 °C, 85
Externí odkaz:
https://doaj.org/article/7f36fce891af472f9f796a7f903e7461
Publikováno v:
Crystals, Vol 11, Iss 11, p 1415 (2021)
Intermetallic compounds (IMCs) are essential in the soldering of electronic products and are composed mainly of Cu6Sn5 and Cu3Sn. They must maintain reliable mechanical and electrical connections. As they are usually only a few microns thick, and it
Externí odkaz:
https://doaj.org/article/02afbf5cd7ac4268ba22781c1116e9fa
Publikováno v:
Journal of Materials Science. 57:17533-17562
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::03a35ef95247d97a581c2392b734c10b
https://doi.org/10.1007/s10853-022-07715-6
https://doi.org/10.1007/s10853-022-07715-6
Publikováno v:
Journal of Materials Science: Materials in Electronics. 33:4924-4939
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2c9893ecb8aaf25ae3925069a6a398c3
https://doi.org/10.1007/s10854-021-07682-9
https://doi.org/10.1007/s10854-021-07682-9
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e44b94dbf444a4f418cbe2b913c480b
https://doi.org/10.1109/eptc56328.2022.10013209
https://doi.org/10.1109/eptc56328.2022.10013209
Autor:
Qiang Zhang, Kailin Pan
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::714cfac612ff7a8fd5f21bdd94ab98f5
https://doi.org/10.1109/icept56209.2022.9873104
https://doi.org/10.1109/icept56209.2022.9873104
Publikováno v:
Journal of Physics: Conference Series. 2483:012017
In order to better understand the influence degree of temperature curve parameters on the growth characteristics of intermetallic compounds (IMC) in solder joints during reflux welding, the influence of different temperature curve parameters on the t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::18b373d7cce1b2f2224ffade8e13aec5
https://doi.org/10.1088/1742-6596/2483/1/012017
https://doi.org/10.1088/1742-6596/2483/1/012017
Publikováno v:
Journal of Physics: Conference Series. 2483:012021
At present, Sn-3.0Ag-0.5Cu (SAC305) solder is one of the commonly used lead-free solders, and copper-clad laminate is the commonly used PCB substrate. SAC solder and copper substrate mainly generate two intermetallic compounds (IMCs) of Cu6Sn5 and Cu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a45611e7232eee76a3b17752d5c2d7be
https://doi.org/10.1088/1742-6596/2483/1/012021
https://doi.org/10.1088/1742-6596/2483/1/012021