Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Kai Pitschmann"'
Autor:
Kai Pitschmann, Jan Wessel, Farabi Ibne Jamal, David W. Wagner, Sebastian Vogt, Subhajit Guha, Christian Wenger, Markus Detert, Ulrich Schumann, Dietmar Kissinger, Bertram Schmidt
Publikováno v:
Current Directions in Biomedical Engineering, Vol 2, Iss 1, Pp 273-277 (2016)
Arteriosclerosis and associated cardiovascular disease remains the leading cause of mortality. Improved methods for vascular plaque detection allow early diagnose and better therapeutic options. Present diagnostic tools require intense technical expe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2a0cde9e1f1223ef98ba5b2a53e12a8e
https://doi.org/10.1515/cdbme-2016-0061
https://doi.org/10.1515/cdbme-2016-0061
Autor:
Markus Detert, Ulrich Schumann, David W. Wagner, Freidank Sebastian, Bertram Schmidt, Kai Pitschmann
Publikováno v:
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.
The goal is to use the hot bar method to join the conductive lines of a flexible interposer with copper wires, which are located inside of the catheter wall. These copper wires with a diameter of 150 μm were integrated during the extrusion process o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a6225df4cfadb705cdf4c63e0dc95fa9
https://doi.org/10.23919/empc.2017.8346844
https://doi.org/10.23919/empc.2017.8346844
Autor:
Markus Detert, David W. Wagner, Bertram Schmidt, Sebastian Freidank, Ulrich Schumann, Kai Pitschmann
Publikováno v:
2017 40th International Spring Seminar on Electronics Technology (ISSE).
The paper deals with the technique of a hot bar technology for joining conductor lines of flexible interposers directly with copper wires inside of a catheter wall. The copper wires were integrated during the extrusion process inside of the catheter
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ff614d8967753a292f5291203def0ef
https://doi.org/10.1109/isse.2017.8000991
https://doi.org/10.1109/isse.2017.8000991
Publikováno v:
2016 39th International Spring Seminar on Electronics Technology (ISSE).
The focus of this work was the development of additive metal deposition techniques on Polydimethylsiloxane based foils. The metallic films provide electrical interconnection to commercial available surface-mount devices. Therefor two maskless techniq
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d7b2be3a76515a529e43af28d57832e6
https://doi.org/10.1109/isse.2016.7563164
https://doi.org/10.1109/isse.2016.7563164
Publikováno v:
2007 IEEE Sensors.
Piezoelectrically actuated plano-convex thickness shear mode (TSM) resonators in lanthanum gallium silicate (langasite) were fabricated. As main fabrication steps a wet etching process and a dry etching process were developed and furthermore graytone
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::681a4d5837a286f2221b745e0661f749
https://doi.org/10.1109/icsens.2007.4388680
https://doi.org/10.1109/icsens.2007.4388680